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Organic silicon modified polyurethane hot melt adhesive

A polyurethane hot-melt adhesive and silicone technology, which is applied in the field of structural adhesives, can solve the problems of reducing the solvent resistance and aging resistance of polyurethane hot-melt adhesive coatings

Inactive Publication Date: 2021-04-30
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These non-reactive system tackifying resins cannot participate in curing to form a crosslinked network, which easily reduces the solvent resistance and aging resistance of polyurethane hot melt adhesive coatings.

Method used

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  • Organic silicon modified polyurethane hot melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Add 100g of dimethyldimethoxysilane into a three-necked flask, add 0.1g of concentrated sulfuric acid, dropwise add 20g of deionized water, raise the temperature to 90°C for 1 hour, then add 10 parts of ethylene glycol, stir evenly and then raise the temperature to 100°C, React for 4 hours, stop the reaction and add toluene, wash with water until neutral, remove the toluene to obtain the product is silicone modified polyether diol;

[0024] Heat 20g of silicone-modified polyether diol, 20g of phenyl silicone oil (HO(MePhSiO)nOH, where n=5), 20g of PE-1320 to 100°C, vacuumize to remove water for 3 hours, and cool down to 50°C , under the protection of nitrogen, add 30g of isocyanate MDI, carry out polymerization reaction for 2 hours, and then add 0.1-2 parts of triethanolamine to obtain silicone-modified polyurethane hot-melt adhesive.

Embodiment 2

[0026] Add 30g of methyldiethoxysilane into a three-necked flask, add 0.05g of trifluoromethanesulfonic acid, dropwise add 8g of deionized water, raise the temperature to 90°C for 2 hours, then add 130g of propylene glycol, stir evenly and heat up to 120°C , react for 6h, stop the reaction and add toluene, wash with water until neutral, remove the toluene to obtain the product is silicone modified polyether diol;

[0027] Heat 50g of silicone-modified polyether diol, 30g of phenyl silicone oil (HO(MePhSiO)nOH, where n=8), 30g of PE-3030 to 120°C, vacuumize to remove water for 5 hours, and cool down to 70°C , under the protection of nitrogen, 30g of isocyanate MDI was added, and the polymerization reaction was carried out for 6 hours, and then 0.1g of 2,2-dimorpholino diethyl ether was added to obtain a silicone-modified polyurethane hot melt adhesive.

Embodiment 3

[0029] Add 100g of methyldiethoxysilane into a three-necked flask, add 0.1 concentrated sulfuric acid, dropwise add 25g of deionized water, heat up to 90°C for 2 hours, then add 130g of propylene glycol, stir evenly, heat up to 120°C, and react for 6h. Stop the reaction and add toluene, wash with water until neutral, remove toluene to obtain the product is silicone modified polyether glycol;

[0030] 40g of silicone-modified polyether diol, 35g of phenyl silicone oil (HO(MePhSiO)nOH, wherein n=10), 30g of polyester polyol PE-2708 was heated to 110°C, vacuumed to remove water for 5 hours, Cool down to 50°C, under nitrogen protection, add 25g of isocyanate MDI, carry out polymerization reaction for 6 hours, then add 0.01g of 2,2-dimorpholino diethyl ether to obtain silicone-modified polyurethane hot melt adhesive.

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Abstract

The invention relates to an organic silicon modified polyurethane hot melt adhesive, which is prepared from the following ingredients in parts by mass: 20 to 50 parts of organic silicon modified polyether glycol, 10 to 20 parts of phenyl silicone oil, 20 to 50 parts of polyester polyol, 10 to 30 parts of isocyanate, 0.1 to 2 parts of catalysts and 0.1 to 1 part of silane coupling agents. According to the invention, the defects of poor solvent resistance, poor aging resistance and the like of the traditional moisture-curable polyurethane hot melt adhesive are overcome; In the technical scheme of the invention, the hydroxyl-terminated polyorganosilicone acrylate copolymer adopts a hydroxyl-containing radical initiator to copolymerize an organosilicone monomer and polyester polyol to form a hydroxyl-terminated organosilicone modified polyester polyol block copolymer, and the organosilicone monomer can improve the solvent resistance and aging resistance of the hot melt adhesive; and water resistance and sweat resistance are improved.

Description

technical field [0001] The invention belongs to the technical field of structural adhesives, and in particular relates to silicone-modified polyurethane hot-melt adhesives and a preparation method thereof, which are mainly used in structural bonding fields such as electronics and electrical appliances, display screens, and lithium batteries. Background technique [0002] Polyurethane hot melt adhesive is a new generation of structural adhesive that can provide excellent bonding performance. It is a type of hot melt adhesive made of polyurethane prepolymer as the main material and various additives. Polyurethane hot melt adhesives are easy to use and environmentally friendly, and their performance is comparable to solvent-based hot melt adhesives. In the past ten years, polyurethane hot melt adhesives have been rapidly developed and widely used in high-end fields such as the electronics and electrical industries, and the automotive industry. Polyurethane hot melt adhesives c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J175/14C08G18/40C08G18/42C08G18/50C08G18/61C08G18/67C08G18/76
CPCC09J175/04C09J175/14C08G18/4018C08G18/42C08G18/5096C08G18/61C08G18/6795C08G18/7671
Inventor 徐庆锟王建斌陈田安
Owner YANTAI DARBOND TECH
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