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Whole machine room unified monitoring platform and method suitable for machine room chip-level heat pipe liquid cooling

A chip-level, liquid-cooled technology, applied in the direction of measuring devices, cooling/ventilation/heating transformation, casing/cabinet/drawer components, etc., can solve problems that cannot meet the needs of operation safety monitoring and green consumption reduction

Pending Publication Date: 2021-04-30
CHINA ACAD OF AEROSPACE AERODYNAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patents 201610286818.3, 201611244824.9, 201710248845.6, and 201811559178.4 disclose cooling devices and systems using a chip-level heat pipe liquid cooling structure in computer rooms. Compared with traditional air-cooled computer rooms, it is a computer room with a new cooling architecture design, and current monitoring technologies cannot To meet its operation safety monitoring and green consumption reduction requirements, therefore, a computer room suitable for liquid cooling and heat dissipation mode is particularly needed, and a system and method for uniform monitoring of all objects in the entire computer room

Method used

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  • Whole machine room unified monitoring platform and method suitable for machine room chip-level heat pipe liquid cooling
  • Whole machine room unified monitoring platform and method suitable for machine room chip-level heat pipe liquid cooling
  • Whole machine room unified monitoring platform and method suitable for machine room chip-level heat pipe liquid cooling

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Experimental program
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Embodiment approach

[0061]As a preferred embodiment, the operating state amount is the state logic value of the monitored object, including boot and shutdown, line high pressure alarm, pipeline high and low voltage lock, voltage current overload, motor overload, communication failure, power input and output status, alarm status Functional data is a instantaneous value of the monitoring objects, including temperature, humidity, voltage, current, power, frequency, speed, torque, load rate, and the like.

[0062]Specifically, the operating status amount refers to the status logic value of the object being monitored, such as booting and shutdown, pipeline high pressure alarm, pipeline high and low voltage lock, voltage current overload, motor overload, communication failure, power supply input and output status, alarm status Wait, the logic value is typically 1 or 0; functional data refers to the operation data indicator of the monitored object, such as temperature, humidity, voltage, current, power, frequenc...

Embodiment 1

[0093]figure 1 A block diagram of a unified monitoring platform suitable for use in a machine room chip-level heat pipe is shown in accordance with one embodiment of the present invention.

[0094]Such asfigure 1 As shown, the full machine room for the machine room chip-level heat pipe is suitable, including: monitoring object 101, monitoring unit 201, signal conversion unit 3, control unit 4, display unit 5; monitoring object 101 includes IT cabinet server equipment , Precision air conditioning equipment, power and humidity in distribution equipment, video security equipment, machine room, chip-level heat pipe operation, machine room and cabinet leakage, liquid cooling power equipment, liquid cold pipe water supply back water data, outdoor atmosphere Parameter, power consumption data, real-time energy consumption PUE data; monitoring unit 201 includes multiple sub-monitor modules, including IT server group communication modules, air conditioning communication modules, distributor acqu...

Embodiment 2

[0105]figure 2 A flow chart showing a unified monitoring method suitable for a machine room chip-level heat pipe cooling in accordance with one embodiment of the present invention.image 3A detailed flow chart showing a unified monitoring method suitable for a machine room chip-level heat pipe cooling in accordance with one embodiment of the present invention.

[0106]Combinefigure 2 withimage 3As shown, the whole machine room for the machine room chip-level heat pipe is used, including:

[0107]Step 1, after the control unit issues an instruction, receive the operating status quantity and functional data acquired by the monitoring unit;

[0108]Step 2, the control unit converts the acquired data and transmits to the display unit;

[0109]Step 3, the control unit determines whether the monitoring device has alarm signal according to the preset data;

[0110]Step 4, the control unit controls the flow rate of the circulation pump and the opening of the spray pump in accordance with the temperature an...

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Abstract

The invention discloses a whole machine room unified monitoring platform and method suitable for machine room chip-level heat pipe liquid cooling. Monitoring objects comprise IT cabinet server equipment, precision air conditioning equipment, power supply and distribution equipment, a temperature and humidity in a machine room, machine room and cabinet liquid leakage conditions, liquid cooling power equipment and liquid cooling pipeline water supply and return data. A monitoring unit comprises an IT server group communication module, an air conditioner communication module, a power distribution cabinet electric quantity acquisition module, an indoor temperature and humidity sensor, a water leakage acquisition module and a motor frequency converter acquisition control module. A signal conversion unit is connected with a plurality of monitoring sub-modules. A control unit outputs alarm information according to the data of the plurality of sub-monitoring modules, and controls the operation of the liquid cooling power equipment according to the liquid cooling pipeline water supply and return data. A display unit is included. According to the invention, through unified monitoring of a plurality of devices of the machine room under a chip-level heat pipe liquid cooling architecture, interaction of a plurality of monitoring systems is avoided, and the operation safety of the liquid cooling machine room is improved.

Description

Technical field[0001]The present invention belongs to the field of machine room monitoring technology, and more particularly to a unified monitoring platform and method suitable for use in a machine room chip-level heat pipe liquid cooling.Background technique[0002]In order to embrace the world's fourth industrial revolutionary wave, in 2020, China put forward new infrastructure construction (new infrastructure) planning to support the transformation of national economies. The new foundation contains 7 content, which is critical to the construction of big data center, because it is the cornerstone that supports 5G network, artificial intelligence, big data, cloud computing, intelligent driving industry. It can be predicted that the next 5-10 years, the construction and operation of the data center (computer room) of all walks of life will enter flourish, digital, automation, and intelligent will be the general trend of global economic development. As a new infrastructure constructio...

Claims

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Application Information

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IPC IPC(8): H05K5/00H05K5/02H05K7/20G01D21/02
CPCH05K7/208H05K7/20827H05K5/02H05K5/0247H05K5/0017H05K5/00H05K7/20836G01D21/02
Inventor 薛志虎谢铭慧聂榕序曲伟刘晁罗晓光陈连忠俞继军艾邦成
Owner CHINA ACAD OF AEROSPACE AERODYNAMICS
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