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Dispersion-strengthened high-silicon aluminum alloy and preparation method thereof

A high-silicon aluminum alloy, dispersion-strengthening technology, applied in additive manufacturing, additive processing, etc., can solve the problems of difficult to effectively improve high-temperature strength, decreased thermal conductivity, poor batch stabilization, etc., to improve service reliability, improve Effects of room temperature and high temperature strength, good thermal conductivity and coefficient of thermal expansion

Pending Publication Date: 2021-05-04
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, by introducing a small amount of highly stable dispersion-strengthened particles into the aluminum matrix, the present invention overcomes the obvious decrease in thermal conductivity of high-silicon aluminum alloys caused by traditional alloying or the addition of reinforcements, the difficulty of effectively improving high-temperature strength, and batch stabilization Bad question

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  • Dispersion-strengthened high-silicon aluminum alloy and preparation method thereof
  • Dispersion-strengthened high-silicon aluminum alloy and preparation method thereof
  • Dispersion-strengthened high-silicon aluminum alloy and preparation method thereof

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preparation example Construction

[0031] The present invention also provides a method for preparing a dispersion-strengthened high-silicon aluminum alloy, please refer to figure 1 , figure 1 A flow chart of the preparation process of the dispersion-strengthened high-silicon aluminum alloy of the present invention. Specifically include the following steps:

[0032] S1: Select microalloying elements.

[0033] S2: Spray-deposited alloy melt: Weigh the microalloy elements and Al-Si alloy matrix according to the metering ratio, and perform melting, slagging and degassing to obtain an alloy melt, and then obtain a spray-deposited ingot through high-pressure atomization and deposition Blank.

[0034] Preferably, the microalloying element is selected from an aluminum master alloy, and the content of the microalloying element in the master alloy is not more than 10%; the melting temperature should be 200-300°C higher than the melting point of the alloy melt.

[0035] S3: Densification treatment: performing densific...

Embodiment 1

[0046] A kind of Al-12Si-0.6Mo alloy is prepared in this embodiment, please refer to the attached figure 1 , figure 1 It is a flow chart of the preparation process of the dispersion-strengthened high-silicon aluminum alloy of the present invention, and the specific steps are as follows:

[0047] S1: Selection of microalloying elements: combined with binary and ternary alloy phase diagrams, and solid solubility and diffusion coefficients of different elements in aluminum, the preferred microalloying elements have a limit solid solubility in aluminum of less than 0.6wt%, The solid solubility at room temperature is less than 0.1wt%, and the diffusion coefficient is less than 8.0×10 -15 cm 2 / s, and the melting point of the dispersion strengthening phase formed by microalloying elements and aluminum and / or silicon is higher than the eutectic temperature of the Al-Si alloy matrix, that is, 577°C; aiming at the microstructure, performance, service environment and structural charac...

Embodiment 2

[0055] The preparation steps of the dispersion-strengthened high-silicon aluminum alloy in this embodiment 2 are the same as those in the embodiment 1, the difference lies in the content of each component and the process condition parameters in the preparation process.

[0056] In this embodiment, a kind of Al-27Si-0.5V is prepared, and the specific steps are as follows:

[0057] S1: Selection of microalloying elements: combined with binary and ternary alloy phase diagrams, and solid solubility and diffusion coefficients of different elements in aluminum, the preferred microalloying elements have a limit solid solubility in aluminum of less than 0.6wt%, The solid solubility at room temperature is less than 0.1wt%, and the diffusion coefficient is less than 8.0×10 -15 cm 2 / s, and the melting point of the dispersion strengthening phase formed by microalloying elements and aluminum and / or silicon is higher than the eutectic temperature of the Al-Si alloy matrix, that is, 577°C;...

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Abstract

The invention relates to a dispersion-strengthened high-silicon aluminum alloy and a preparation method thereof. The dispersion-strengthened high-silicon aluminum alloy comprises the following raw material components: dispersion-strengthened particles and an Al-Si alloy matrix, and the mass fraction of silicon in the Al-Si alloy matrix is 12%-70%. The preparation method of the dispersion-strengthened high-silicon aluminum alloy comprises the following steps of S1, selecting microalloying elements; S2, spraying and depositing an alloy melt; S3, carrying out densification treatment; and S4, carrying out heat treatment. According to the dispersion-strengthened high-silicon aluminum alloy and the preparation method thereof, the dispersion-strengthened particles are uniformly distributed in the dispersion-strengthened high-silicon aluminum alloy, so that the dispersion-strengthened high-silicon aluminum alloy not only effectively improves the room-temperature and high-temperature strength of the high-silicon aluminum alloy, but also can keep good thermal conductivity and thermal expansion coefficient; and meanwhile, good machining performance is achieved, the service reliability of the dispersion-strengthened high-silicon aluminum alloy is improved, a formed weld joint is attractive after laser welding, and the requirement for electronic packaging is met.

Description

technical field [0001] The invention relates to the technical field of preparation, development and application of metals and alloys, in particular to a dispersion-strengthened high-silicon aluminum alloy and a preparation method thereof. Background technique [0002] High-silicon-content aluminum-silicon alloy generally refers to an alloy with a silicon content exceeding the eutectic composition (>12.6%, mass fraction), which has the advantages of low density, high thermal conductivity, good thermal expansion matching, and good process performance. It is used as an electronic packaging material , pistons, etc. have important application value in high-tech fields such as military, aviation, aerospace, and transportation. In conventional casting alloys, due to the low cooling rate (less than 100°C / s), the macro-segregation of the silicon phase is serious and the distribution uniformity is poor. (>100μm), sharp edges and corners, which severely split the continuity of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/02C22F1/043C22F1/00B22F10/22B22F10/64C22C28/00C22C32/00B33Y10/00B33Y80/00
CPCC22C21/02B22F3/115B22F3/24C22F1/043C22F1/002C22C28/00C22C32/00B33Y10/00B33Y80/00B22F2003/248
Inventor 蔡志勇王日初彭超群钟剑锋纪乐
Owner CENT SOUTH UNIV
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