Implantable flexible electronic device and preparation method thereof

A flexible electronic device, implantable technology, applied in the fields of electrotherapy, electrical components, printed circuit manufacturing, etc., can solve the problem of poor water barrier ability, water barrier performance of implantable flexible electronic devices, biocompatibility Young's mode It is difficult to comprehensively control and control the properties such as quantity, and the biocompatibility is poor, so as to achieve the effect of excellent use effect, excellent biocompatibility and water barrier effect.

Active Publication Date: 2021-05-04
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]Encapsulation is very critical for implantable flexible electronic devices. However, the traditional packaging of implantable flexible electronic devices usually only sets the encapsulation layer on the circuit components. When the hydrophilic polymer material is used for the encapsulation layer, although the biocompatibility is good, the water barrier ability is relatively poor. When the hydrophobic polymer material is used for the encapsulation layer, although the water barrier capacity is relatively good, the biocompatibility Poor, making it difficult to comprehensively control the water barrier performance, biocompatibility and Young's modulus of implantable flexible electronic devices

Method used

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  • Implantable flexible electronic device and preparation method thereof
  • Implantable flexible electronic device and preparation method thereof
  • Implantable flexible electronic device and preparation method thereof

Examples

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preparation example Construction

[0039] The preparation method of the implantable flexible electronic device provided by the present invention comprises:

[0040] S1, providing a body, the body including a flexible substrate and a circuit assembly disposed on the flexible substrate;

[0041] S2, making a hydrophobic shell covering the body on the body;

[0042] S3, fabricating a hydrophilic shell covering the hydrophobic shell on the hydrophobic shell to obtain an implantable flexible electronic device.

[0043] In step S1, the circuit assembly may be exposed on the surface of the flexible substrate, or embedded in the flexible substrate.

[0044] Wherein, the material of the flexible matrix is ​​selected from natural or synthetic polymer materials, including polydimethylsiloxane, polyimide, polylactic acid-glycolic acid copolymer, polyvinyl alcohol, polycaprolactone, poly At least one of lactic acid, polyoctylene glycol-citric acid copolymer, polyoctylene glycol-maleic anhydride-citric acid copolymer, cell...

Embodiment 1

[0092] A body of a flexible electronic device is provided, the body includes a flexible substrate and a circuit assembly disposed on the flexible substrate, wherein the flexible substrate is a polydimethylsiloxane substrate, the circuit assembly includes electronic components and is used to provide electronic components The wire that carries the current, the material of the wire is gold, and the electronic components include capacitors, inductors, diodes and light-emitting diodes.

[0093] The first hydrophobic precursor solution is coated on the surface of the flexible substrate with circuit components by spin coating, and irradiated with ultraviolet light with a wavelength of 365nm, so that the first hydrophobic precursor solution is cured into a hydrophobic film with a thickness of 35 μm. layer to obtain the core. Wherein, the first hydrophobic precursor solution includes a mixture of three hydrophobic molecules of 4-pentene anhydride, triallyl isocyanurate and 1,4-butanedi...

Embodiment 2

[0098] The difference between Example 2 and Example 1 is that the second hydrophobic precursor solution is a mixture of three hydrophobic molecules: 4-pentene anhydride, triallyl isocyanurate, and 1,4-butanedithiol. Mixture, the molar ratio of three hydrophobic molecules is 1:2:4.

[0099] Compared with Example 1, the implantable flexible electronic device obtained in Example 2 has a better water-proof effect.

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Abstract

The invention relates to an implantable flexible electronic device and a preparation method thereof, and the preparation method comprises the steps: providing a body which comprises a flexible substrate and a circuit assembly disposed on the flexible substrate; manufacturing a hydrophobic shell layer wrapping the body on the body; and manufacturing a hydrophilic shell layer wrapping the hydrophobic shell layer on the hydrophobic shell layer to obtain the implantable flexible electronic device. The Young modulus of the implantable flexible electronic device is closer to the Young modulus of human tissues, and the implantable flexible electronic device has excellent biocompatibility and waterproof effect and is more excellent in use effect.

Description

technical field [0001] The invention relates to the technical field of flexible electronics, in particular to an implantable flexible electronic device and a preparation method thereof. Background technique [0002] Encapsulation is very critical for implantable flexible electronic devices. However, the packaging of traditional implantable flexible electronic devices usually only has an encapsulation layer on the circuit components. When the encapsulation layer uses hydrophilic polymer materials, although biocompatibility Good, but relatively poor water-proof ability, when the encapsulation layer uses hydrophobic polymer materials, although the water-proof ability is relatively good, but the biocompatibility is poor, resulting in the water-proof performance of implantable flexible electronic devices, Properties such as biocompatibility and Young's modulus are difficult to control comprehensively. Contents of the invention [0003] Based on this, it is necessary to address...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K1/02A61B5/026A61N1/36A61N5/06C08F289/00C08F222/38C08G63/52C08G75/045
CPCH05K1/0283H05K3/284H05K3/285C08F289/00C08G63/52C08G75/045A61N1/36125A61N5/062A61B5/026C08F222/385
Inventor 冯雪郑司雨陈颖
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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