Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board with embedded heat dissipation material and manufacturing method thereof

A heat-dissipating material and manufacturing method technology, applied in the direction of printed circuit manufacturing, printed circuit, circuit heating device, etc., can solve the problems of unfavorable long-term reliability of circuit boards, large differences in thermal conductivity, complicated process flow, etc., and achieve improvement of adhesive flow Defects, optimized thermal conductivity, improved life and long-term reliability effects

Active Publication Date: 2021-05-14
KUSN HULI MICROELECTRONICS
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The patent with the application number CN201510251730.3 discloses a method of manufacturing printed circuit boards with embedded copper blocks, including the steps of pressing the buried copper blocks, milling grooves, immersion gold, and pressing the embedded copper blocks. Achieved the purpose of improving product yield and production efficiency, and has the characteristics of good quality consistency, but the process is complicated and the cost is high
[0006] The combination between the heat dissipation material and the insulating substrate needs to be filled with flowing resin in the gap between the two in the pressing step, which requires high glue content and fluidity of the adhesive sheet, and the existing technology is prone to glue filling Insufficient condition
The heat dissipation material itself has a large difference in thermal conductivity from the surrounding resin. When the heat of the components is transferred to the circuit board, there is an obvious temperature gradient at the interface between the heat sink and the resin, which is not conducive to the long-term reliability of the entire circuit board.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board with embedded heat dissipation material and manufacturing method thereof
  • Circuit board with embedded heat dissipation material and manufacturing method thereof
  • Circuit board with embedded heat dissipation material and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] (1) Add large particles with a particle size of 25-30 μm and small particles with a particle size of 3.8-4.7 μm into the resin system to prepare glue; for particles with different particle sizes, ball mills of different specifications or other methods can be used to obtain them.

[0038] The particles of the two particle sizes selected in Example 1 are mixed to form a stacking model A. According to the packing model A, the relationship between the large particle radius R and the small particle radius r can be inversely verified.

[0039] Stacked model A such as figure 1 The hexagonal closest-packed regular hexahedral cylinder shown, the large particles are located at the twelve vertices of the regular hexahedral cylinder, and there are three small particles in the middle of the regular hexahedral cylinder; figure 2 for figure 1 A tetrahedron separated from , figure 2 A regular tetrahedron unit can be split in the middle, the side length of the bottom triangle of the...

Embodiment 2

[0047] (1) Add large particles with a particle size of 25-30 μm and small particles with a particle size of 15.8-18.9 μm in the adhesive to prepare glue; for particles with different particle sizes, ball mills of different specifications or other methods can be used to obtain them .

[0048] The particles of the two particle sizes selected in Example 2 are mixed to form the packing model B, and the relationship between the large particle radius R and the small particle radius r can be verified by inverse deduction according to the packing model B.

[0049] Stacking model B is Figure 6 In the body-centered cubic packing shown, the large particles are located at the eight vertices of the cube, and the small particles are located at the center of the cube, where, a 2 +b 2 =(4R) 2 ,therefore Stacked Model B's according to Figure 7 , Figure 8 Calculation, It is consistent with the particle size relationship between the large particle size and the small particle si...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for manufacturing a circuit board with an embedded heat dissipation material, and the method comprises the following steps: selecting resin, adding a filler into a resin system, and preparing a glue solution; selecting a heat dissipation material, and generating a glue layer on the side surface of the heat dissipation material; carrying out baking treatment on the heat dissipation material with the glue layer on the side surface to enable the adhesive layer to be in a semi-curing stage; and embedding the heat dissipation material with the semi-cured adhesive layer into the insulating substrate, and pressing to manufacture the circuit board. According to the method provided by the invention, the glue flowing defect can be improved to a great extent, and the condition of insufficient glue filling is avoided; by adding and blending the filler, the heat-conducting property of the adhesive layer is optimized, the temperature gradient of the interface of the heat-dissipating material and the insulating substrate is reduced, the difference of thermal expansion coefficients between the heat-dissipating material and surrounding resin is reduced, and cracks caused by the difference of the thermal expansion coefficients of different materials in a high-low temperature alternate use environment for a long time are reduced; the electrical property and insulativity of the circuit board are ensured, and the service life and long-term reliability of the circuit board are effectively improved.

Description

technical field [0001] The invention relates to a circuit board embedded with a heat dissipation material and a manufacturing method thereof, belonging to the technical field of printed circuit boards. Background technique [0002] With the rapid development of electronic products in the direction of thinning, miniaturization and high integration, higher requirements are put forward for the high thermal conductivity and high voltage resistance of printed circuit boards. In order to make the circuit board meet the heat dissipation requirements, the method of embedding heat dissipation materials such as embedded copper blocks or embedded ceramics is usually used. Embedded heat dissipation material can greatly improve the heat dissipation performance of the circuit board, but there are still some problems, such as: [0003] The patent with the application number CN201180037321.3 discloses a circuit board, which includes an insulating substrate of a resin base material and a co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/00H05K1/0204H05K2201/06
Inventor 林梦榕胡赵霞董香灵周智洋
Owner KUSN HULI MICROELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com