Halogen-free flame-retardant PC/ABS alloy material and preparation method thereof

Abstract

The invention discloses a halogen-free flame-retardant PC / ABS alloy material, which is prepared from the following components in parts by weight: 40 to 60 parts of flame-retardant PC master batch, 15 to 30 parts of first polycarbonate, 10 to 22 parts of second polycarbonate, 5 to 10 parts of acrylonitrile-butadiene-styrene copolymer, 2 to 4 parts of methacrylate-butadiene-styrene copolymer, 1 to 2 parts of ethylene acrylate copolymer, 0.3 to 0.6 part of polytetrafluoroethylene, 0.2 to 0.4 part of stearate and 0.1 to 0.3 part of antioxidant. According to the halogen-free flame-retardant PC / ABS alloy material and the preparation method thereof provided by the invention, the halogen-free flame-retardant PC / ABS alloy material has relatively high elongation at break, high performance retention rate under high temperature and high humidity, and strong chemical reagent resistance, and can improve the problems that the PC / ABS is easy to break when being applied to a screw stud and a buckle on an electronic and electrical appliance shell, the performance is severely degraded under high temperature and high humidity, and the PC / ABS alloy material is easy to induce cracking when being in contact with a chemical reagent and the like, so that the PC / ABS material can be widely applied in the field of electronic and electrical appliances and under severe environment requirements.

Description

technical field [0001] The invention belongs to the field of polymer material modification, in particular to a halogen-free flame-retardant PC / ABS alloy material and a preparation method thereof. Background technique [0002] Nowadays, electronic and electrical equipment has become an indispensable part of people's life and work. The application site and use environment will inevitably encounter high temperature, high humidity and contact with chemical reagents, and the shell of electronic and electrical equipment is generally made of polymer materials, and its shell structure is often There will be screw posts and buckles; while the conventional halogen-free flame-retardant PC / ABS material is used as the shell because of its large internal stress, the screw posts will often crack and the buckles will break. In addition, under high temperature and high humidity environment The long-term service performance retention rate drops greatly, and the retention rate is less than 50%...

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Problems solved by technology

[0002] Nowadays, electronic and electrical equipment has become an indispensable part of people's life and work. The application site and use environment will inevitably encounter high temperature, high humidity and contact with chemical reagents, and the shell of electronic and electrical equipment is generally made of polymer materials, and its shell structure is often There will be screw posts and buckles; while the conventional halogen-free flame-retardant PC / ABS material is used as the shell because of its large internal stress, the screw posts will often crack and the buckles will break. In addition, under high temperature and high humidity environment The long-term service performance retention rate drops greatly, and the retention rate is less than 50%. After contact with chemical reagents, internal stress is induced to cause cracks or even cracks; Material development is particularly important

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