Trench type high-voltage isolation capacitor device based on Trench process and preparation method
A high-voltage isolation, trench-type technology, applied in the direction of capacitors, electric solid devices, electrical components, etc., can solve the problems of increased process costs, affecting the signal transmission of high-voltage isolation capacitors, etc., and achieve the effect of high isolation voltage
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Embodiment 1
[0046] A trench-type high-voltage isolation capacitor device based on Trench technology, four grooves 2 are opened on a silicon substrate 1, and the silicon substrate 1 on the side and bottom surface of the groove 2 and the upper surface of the silicon substrate 1 are processed High-temperature oxidation to form a silicon dioxide dielectric layer 3, each groove 2 is filled with polysilicon, the polysilicon located in the leftmost and rightmost grooves 2 forms a grounded polysilicon 4, and the polysilicon located in the middle groove 2 Form the high-voltage isolation capacitor polysilicon 5, on the upper surface of the polysilicon is provided with an insulating covering silicon dioxide layer 6, on the insulating covering silicon dioxide layer 6 is provided with an insulating covering silicon nitride layer 7, on the insulating covering silicon dioxide layer 6 A contact hole is opened on the silicon nitride layer 7 covered with insulation, and a ground polysilicon lead-out electro...
Embodiment 2
[0065] A trench-type high-voltage isolation capacitor device based on Trench technology, four grooves 2 are opened on a silicon substrate 1, and the silicon substrate 1 on the side and bottom surface of the groove 2 and the upper surface of the silicon substrate 1 are processed High-temperature oxidation to form a silicon dioxide dielectric layer 3, each groove 2 is filled with polysilicon, the polysilicon located in the leftmost and rightmost grooves 2 forms a grounded polysilicon 4, and the polysilicon located in the middle groove 2 Form the high-voltage isolation capacitor polysilicon 5, on the upper surface of the polysilicon is provided with an insulating covering silicon dioxide layer 6, on the insulating covering silicon dioxide layer 6 is provided with an insulating covering silicon nitride layer 7, on the insulating covering silicon dioxide layer 6 A contact hole is opened on the silicon nitride layer 7 covered with insulation, and a ground polysilicon lead-out electro...
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