1results about How to "High isolation voltage" patented technology

This application provides a stacked optocoupler packaging structure and its fabrication method, belonging to the field of optoelectronic semiconductor packaging technology. The structure includes: an emitter lead frame, an infrared chip, a receiver lead frame, and a photosensitive chip; the infrared chip is flip-chip bonded to the emitter lead frame; the photosensitive chip is bonded to the receiver lead frame; the emitter and receiver lead frames are stacked vertically; a Fresnel focusing lens is positioned above the photosensitive chip and bonded to it with an adhesive; a packaging shell is composed of a transparent inner potting compound layer and a black outer potting compound layer, formed sequentially by molding. The packaging shell encapsulates the emitter assembly, receiver assembly, and Fresnel focusing lens, and exposes some pins of the emitter and receiver lead frames. This application achieves high isolation voltage, reduces packaging size, improves photoelectric conversion efficiency, enhances long-term reliability, and simplifies the manufacturing process.