A kind of ion beam coating equipment and coating method thereof

Abstract

The invention discloses an ion beam coating equipment and a coating method thereof. The equipment comprises a transfer chamber, a chip loading and unloading chamber, a coating chamber and a cleaning chamber connected to the transfer chamber, and an isolation valve is arranged between them. The transfer chamber is provided with a transfer mechanism. The coating method adopts the above-mentioned equipment for coating treatment. In the present invention, the loading and unloading chamber is used to store different types of substrates, the transfer chamber realizes the transfer of the substrates between the loading and unloading chamber, the coating chamber and the cleaning chamber, and the coating chamber can realize the Coating multiple substrates at the same time can also realize the preparation of various types of film layers, cleaning the chamber, removing dirt and oxides on the surface of the substrate, and improving the adhesion between the film and the substrate. The ion beam coating equipment of the invention can realize continuous cleaning and continuous coating of substrates, can realize continuous production, improve production efficiency, reduce production costs, and can meet the requirements of substrates (such as infrared devices) for large-size, low-damage and low-temperature coating processes. Require.

Description

technical field [0001] The invention relates to an ion beam coating equipment and a coating method thereof. Background technique [0002] Ion beam sputtering coating technology is one of the most important technologies in various coating technologies, and is widely used in the fields of optical components, aero-engines, microelectronic devices and material surface treatment. [0003] The substrate metallization and passivation / insulation layer process requires good adhesion between the film and the substrate, as well as maintaining a low temperature during the deposition process of the substrate and a large uniform area of ​​the deposited film. Therefore, it is necessary to remove the impurity material on the surface of the substrate before coating. However, in the existing coating equipment, cleaning and coating are completed in two different equipment, and there are the following defects: (1) Only a single substrate can be coated, and multiple substrates cannot be coated a...

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Problems solved by technology

[0003] Substrate metallization and passivation / insulation layer processes require good adhesion between the film and the substrate, as well as low temperature during substrate deposition and a large uniform area of ​​deposited film. Therefore, it is necessary to remove impurity materials on the surface of the substrate before coating However, in the existing coating equipment, cleaning and coating are completed in two different equipments, and there are following defects: (1) can only realize the coating of a single substrate, and cannot simultaneously coat a plurality of substrates, nor can Realize the simultaneous preparation of different types of films, which cannot be mass-produced; (2) does not have the function of an independent loading and unloading chamber, and the process chamber needs to be opened every time cleaning and coating are completed, which takes a long time to establish a vacuum, short effective working time, and low coating efficiency ;(3) Most of the existing ion beam coating equipment are small-sized substrates and manual scientific research equipment, which do not have the automatic adjustment function of cleaning angle and coating angle, and do not have the online monitoring function of the coating film layer; (4) Without a temperature control device and a cooling device, it is impossible to ensure that the infrared device is cleaned and coated at a lower temperature, which may easily cause the loss of the infrared device. This is because the substrate material of the infrared device is HgCdTe, which is heated by plasma bombardment. After reaching a certain temperature, mercury atoms are easy to escape, which will cause chip damage

In addition, the existing ion beam coating equipment usually uses a multi-faceted target platform for multi-layer thin film preparation, and there is cross-contamination phenomenon. At the same time, the workpiece platform does not have the angle adjustment function, and it is difficult to meet the requirements of different crystal orientation materials on the substrate deposition angle.

The existence of the above-mentioned defects makes it difficult for existing ion beam coating equipment to meet the requirements of large-size, high-uniformity, low-damage, and low-temperature coating processes for substrates (such as infrared devices)

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