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Reworkable adhesive composition

A composition and adhesive technology, applied in the direction of adhesive type, ester copolymer adhesive, graft polymer adhesive, etc., can solve the problem that the adhesive is not easy to meet

Active Publication Date: 2021-06-04
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these applications create unique requirements that are not easily met by previously available adhesives

Method used

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  • Reworkable adhesive composition
  • Reworkable adhesive composition
  • Reworkable adhesive composition

Examples

Experimental program
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Embodiment

[0065] The following materials were used in the examples. MMA is methyl methacrylate ex Evonik. MAA is methacrylic acid from Sinopharm. THFMA is tetrahydrofurfuryl methacrylate from TCI. IBOMA is isobornyl methacrylate from TCI. EHMA is ethylhexyl methacrylate ex Evonik. Blend 338 is polyacrylonitrile-b-butadiene from GE. Core-shell-2670 is poly(methacrylate-butadiene-styrene) from DOW. 1116K is poly(styrene-butadiene-styrene) ex Kraton. TMPTMA is trimethylolpropane trimethacrylate from TCI. VTB is a vinyl terminated liquid rubber from CRAY VALLEY. P1-M is an adhesion promoter from Kyeisha. DMPT is N,N-dimethyl-p-toluidine from Sinopharm. Wax 58 is a wax from Sinopharm. HEPT is dihydroxyethyl-p-toluidine from Sinopharm. N-tert-butylacrylamide was from Sinopharm. BHT is 2,6-di-tert-butyl-p-cresol from Sinopharm. 2021 is poly(methyl methacrylate) from Lucite International. PhEMA is phenoxyethyl methacrylate from TCI. BPO is benzoyl peroxide from Sinopharm. EPON 8...

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Abstract

A reworkable adhesive composition for assembling electronic devices, which when cured, has a good adhesion strength at room temperature and an excellent reworkability at elevated temperature.

Description

technical field [0001] The present invention relates to reworkable adhesive compositions for assembling electronic devices. In particular, the present invention relates to a reworkable adhesive composition which, when cured, provides good bond strength at room temperature and excellent adhesive strength at elevated temperatures. reworkability. Background technique [0002] Typical (meth)acrylic based structural adhesives exhibit strong adhesive properties on most common substrates. Such adhesives have found increasing use in the automotive industry and electronics where adhesive bonding is replacing welding and mechanical fastening techniques. However, these applications create unique requirements that are not easily met by previously available adhesives. These requirements include high bond strength and improved bond failure modes when using the joined parts in everyday life. Today, however, there is a requirement for reworkability when assembling components to avoid mi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J11/08C09J133/00
CPCC08F287/00C08F285/00C09J4/06C08F220/14C08F220/281C08F220/1811C08F222/103C08F220/54C09J4/00C09J133/04C09J11/08C09J7/10C09J2203/37C09J2301/312C09J151/003B32B37/12C09J5/00
Inventor 施朱明陆琤杨玉衡N·斯威尼B·科尼夫赛
Owner HENKEL KGAA