Three-dimensional integrated interlayer optical interconnection structure and forming method thereof

Abstract

The invention provides a three-dimensional integrated interlayer optical interconnection structure and a forming method thereof. The three-dimensional integrated interlayer optical interconnection structure comprises a first functional material layer, an optical isolation layer, a second functional material layer and an interlayer waveguide; the first functional material layer and the second functional material layer are isolated through an optical isolation layer; the interlayer waveguide is located in the optical isolation layer and is connected with the first functional material layer and the second functional material layer; the first functional material layer comprises a first optical waveguide channel, a first wedge-shaped waveguide and a first grating coupling waveguide; and the second functional material layer comprises a second optical waveguide channel, a second wedge-shaped waveguide and a second grating coupling waveguide. According to the invention, the wedge-shaped waveguide is converted to a proper width, and the processed optical signal is transmitted to the interlayer waveguide through the grating coupler, so that the low-loss transmission of the optical signal between the layers is realized. The three-dimensional integrated interlayer optical interconnection structure has the advantages of wide application range, low loss of three-dimensional integrated interlayer interconnection, high extinction ratio and high integration level.

Description

Technical field [0001] The present invention relates to the field of three-dimensional optics, and in particular, to a three-dimensional integrated interlayer optical interconnection structure and forming method. Background technique [0002] In recent years, Silicon-On-Insurator, SOI material is compared with a high refractive index, which is compatible with the mature CMOS process, so that the SOI material is more compact, large, high-density photon integration. Maybe. However, the integration of simple faces has become more difficult to meet the needs of high performance, high integration, and low power consumption. More and more researchers are closely concerned about the three-dimensional mixed integration, which will provide solutions for future high-rate communications, low power, low time delay and multi-functional requirements. [0003] At present, there are many problems in the transmission between different architecture layers, and the three-dimensional integrated shee...

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Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a three-dimensional integrated interlayer optical interconnection structure and forming method for solving the problem in the prior art that optical signals are difficult to transmit with low loss between three-dimensional integrated layers

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