Preparation method of silicon surface passivation layer
A passivation layer and silicon surface technology, which is applied in coating, gaseous chemical plating, final product manufacturing, etc., can solve the problems of high cost of energy-consuming equipment and high equipment cost
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[0034] Embodiment 1, the preparation of silicon surface passivation layer
[0035] 1. Cleaning
[0036] (1) Immerse the raw silicon wafer (melted silicon wafer in the double-sided polishing area, resistivity 1-5 ohm cm, thickness 280 μm, φ2 inch) into H with a volume ratio of 3:1 2 SO 4 and H 2 o 2 In the mixed solution, heat to 100 degrees Celsius and keep warm for 15 minutes; take out the silicon wafer and rinse it with deionized water for 2 minutes;
[0037] (2) Immerse the silicon wafer cleaned in step (1) in NH with a volume ratio of 1:1:5 4 OH, H 2 o 2 , in a mixed solution of deionized water, heated to 80 degrees Celsius, and kept for 15 minutes; take out the silicon wafer, and rinse it with deionized water for 2 minutes;
[0038] (3) immerse the silicon wafer after step (2) cleaning into HCl, H with a volume ratio of 1:1:5 2 o 2 , in a mixed solution of deionized water, heated to 80 degrees Celsius, and kept for 15 minutes; take out the silicon wafer, and rins...
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