Ultrasonic vibration device and design method
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 安徽天航机电有限公司
- Publication Date
- 2021-06-11
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Abstract
Description
technical field
[0001] This application relates to ultrasonic vibration assisted processing technology, combined with ultrasonic vibration technology, transforming traditional continuous processing into periodic pulse processing. Background technique
[0002] In recent years, aerospace and other fields have developed rapidly, and materials such as composite materials, hard alloys, and titanium alloys have become more and more widely used. Due to the characteristics of such materials such as high hardness, high strength, and low thermal conductivity, the use of traditional machining will cause problems such as excessive cutting force and high cutting heat in the cutting area, resulting in machine tool vibration, tool wear, and chip adhesion. Make the surface quality and shape and position tolerance difficult to meet the requirements. In order to further improve the machining quality of key parts, it is urgent to propose a new machining method.
[0003] Ultrasonic vibration ...