Method for sputtering aluminum layer on copper substrate and aluminum atom transfer copper plastic film

A copper substrate and sputtering technology, which is applied in sputtering plating, metal material coating process, coating, etc., can solve the difficulty of combining aluminum layer and copper layer, easy peeling off of electroplated aluminum layer, exposure of copper layer, etc. problems, to achieve the effect of low water vapor transmission rate, small number of pinholes, and ensure safety performance

Active Publication Date: 2021-06-11
ZHEJIANG TONY ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since a passivation layer is easily formed on the aluminum layer, the copper layer of the copper-plastic film can be well bonded to the protective layer and the heat-sealing layer through the aluminum layer, so that the protective layer and the heat-sealing layer are not easy to fall off, and the lithium battery is improved. It is safe to use, but this patent also has defects: the combination of the aluminum layer and the copper layer is difficult, the electroplated aluminum layer on the copper layer is easy to fall off, and the aluminum layer on the copper layer is easy to delaminate during the bending and shaping process of the material, resulting in the copper layer Part or all of them are easily exposed to the electrolyte, and there is still a greater risk

Method used

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  • Method for sputtering aluminum layer on copper substrate and aluminum atom transfer copper plastic film
  • Method for sputtering aluminum layer on copper substrate and aluminum atom transfer copper plastic film

Examples

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Effect test

Embodiment 1

[0033] This embodiment provides a method for sputtering an aluminum layer on a copper substrate. The alloy aluminum target doped with metal nickel is used as the first target, and the surface of the first target is bombarded by inert gas ions to make the first target The surface atoms overflow and deposit on the surface of the copper substrate to form a pre-shot layer; then the pure aluminum target (the purity of aluminum is 99.9999%) is used as the second target, and the surface of the second target is bombarded by inert gas ions to make the surface atoms of the second target The main body layer is formed by overflowing and covering the surface of the pre-injection layer; the pre-injection layer and the main body layer constitute an aluminum layer. The method for sputtering an aluminum layer on the copper substrate specifically comprises the following steps:

[0034] Step 1. Start the magnetron sputtering coating machine with a cold machine, load the first target and the seco...

Embodiment 2

[0038] This embodiment provides an aluminum atom transfer copper-plastic film, such as figure 1 As shown, it includes a copper foil layer 1, a protective layer 2 arranged on the outside of the copper foil layer 1, and a heat-sealing layer 3 arranged on the inside of the copper foil layer 1, and a first A barrier layer 4, a second barrier layer 5 is provided between the copper foil layer 1 and the heat-sealing layer 3; the first barrier layer 4 and the second barrier layer 5 are attached to the copper foil layer by sputtering The aluminum layer on the surface of 1 has a passivation film on the surface of the aluminum layer; the surface of the first barrier layer 4 away from the copper foil layer 1 is bonded to the protective layer 2 through an adhesive, and the second barrier layer 5 The surface of the side away from the copper foil layer 1 is bonded to the heat-sealing layer 3 through an adhesive, the adhesive is maleic acid modified polypropylene; the protective layer 2 is a ...

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Abstract

The invention belongs to the technical field of lithium battery packaging materials, and particularly discloses a method for sputtering an aluminum layer on a copper substrate and an aluminum atom transfer copper plastic film. According to the method for sputtering the aluminum layer on the copper substrate, an alloy aluminum target doped with bridging metal serves as a first target material, the surface of the first target material is bombarded through inert gas ions, and atoms on the surface of the first target material overflow and are deposited on the surface of the copper substrate to form a pre-injection layer; and then a pure aluminum target serves as a second target material, the surface of the second target material is bombarded through inert gas ions, and atoms on the surface of the second target material overflow and cover the surface of the pre-injection layer to form a main body layer. According to the method for sputtering the aluminum layer on the copper substrate and the aluminum atom transfer copper plastic film, the problem that the combination difficulty of the copper substrate and the aluminum layer is large can be solved, the prepared aluminum atom transfer copper plastic film is not prone to layering, and the safety of a soft package battery is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of lithium battery packaging materials, and in particular relates to a method for sputtering an aluminum layer on a copper substrate and an aluminum atom transferable copper-plastic film. Background technique [0002] Lithium-ion battery is a secondary battery (rechargeable battery), which mainly relies on the movement of lithium ions between the positive and negative electrodes to work. A lithium-ion battery consists of a positive electrode, a negative electrode, a separator, an electrolyte, a current collector, and an outer casing. The chemical properties of the active components of lithium-ion batteries are very active, and it is very easy to catch fire or even explode when placed in the air. Therefore, the packaging shell of lithium-ion batteries should have certain corrosion resistance and very good barrier properties. [0003] At present, the commonly used packaging for lithium-ion batteries includes ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35H01M50/124H01M50/119H01M50/145H01M50/131H01M10/0525
CPCC23C14/352H01M10/0525Y02E60/10
Inventor 沈晓宇
Owner ZHEJIANG TONY ELECTRONICS CO LTD
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