High-strength low-dielectric-constant low-dielectric-loss composite material and preparation method thereof

Abstract

The invention discloses a high-strength low-dielectric-constant low-dielectric-loss composite material and a preparation method thereof. The composite material comprises thermosetting polyolefin resin, reinforced fibers, ultra-high molecular weight polyethylene fibers and / or ultra-high molecular weight polyethylene cloth. The thermosetting polyolefin resin, the ultra-high molecular weight polyethylene fiber and / or the ultra-high molecular weight polyethylene cloth are compounded to have the outstanding advantages of small dielectric constant, nonpolarity and the like, and then the reinforced fiber with high strength is compounded, so that the overall strength can be further improved, and the problems of overhigh dielectric constant, insufficient strength, and difficulty of meeting reliability and miniturization requirements of electronic integrated devices of the material in the prior art are effectively solved. The high-strength low-dielectric-constant low-dielectric-loss composite material prepared by the preparation method disclosed by the invention has the advantages that the dielectric constant is less than 2.4 F / m, and the beneficial effects of small dielectric constant, nonpolarity, high strength, light weight, low cost and the like are realized.

Description

technical field [0001] The invention relates to the technical field of low dielectric constant materials, in particular to a high-strength low dielectric constant and low dielectric loss composite material and a preparation method. Background technique [0002] Low dielectric constant materials or low-K materials (low-K materials) are a hot topic in the current semiconductor industry research. By reducing the dielectric constant of the dielectric material used in the integrated circuit, the leakage current of the integrated circuit can be reduced, the capacitive effect between the wires can be reduced, and the heating of the integrated circuit can be reduced. [0003] In recent years, with the high-speed and high-frequency signal transmission and the shortening of the transmission distance, circuits and components must be increased in density. The integration level of integrated circuits has increased rapidly, and the operating frequency range of radio frequency connectors,...

AI Technical Summary

Problems solved by technology

[0008] The embodiment of the present application provides a high-strength composite material with low dielectric constant and low dielectric loss, which solves the problem that the dielectric constant of the material in the prior art is too high and the strength is not enough, which makes it difficult to meet the reliability and miniaturization requirements of electronic integrated devices. The technical problem of compounding thermosetting polyolefin resin, reinforcing fiber and ultra-high molecular weight polyethylene fiber or ultra-high molecular weight polyethylene cloth, the dielectric constant of the new composite material is less than 2.4F / m, and the strength is higher

Images