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A kind of preparation method of polyimide film with high elongation at break

A technology of polyimide film and elongation, which is applied in the field of modification of organic polymer materials, can solve problems such as complicated operation, and achieve the effect of simple operation of the preparation method, excellent mechanical properties, and improved elongation at break

Active Publication Date: 2022-08-05
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the operation of the invention is complicated, and it needs to be separated into powder and other treatments in the reaction process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) In a 100 ml three-necked flask equipped with a nitrogen inlet and mechanical stirring, add 2.0024 g (0.01 mol) of 4,4'-diaminodiphenyl ether (ODA) to 18 ml of the organic solvent N,N-dimethylene Dissolve in acetamide (DMAc) with stirring. When the diamine was completely dissolved, 2.2248 grams (0.0102 mol) of pyromellitic dianhydride (PMDA) was added in 4 portions with stirring. The solution was stirred in an ice-water bath for 12 hours to obtain a viscous solution of polyamic acid with a solid content of 20%. After the reaction, 33 ml of N,N-dimethylacetamide was added to the solution to reduce the solid content of the polyamic acid solution to 8% to obtain a polyamic acid solution;

[0032](2) 1.2916 g (0.01 mol) of isoquinoline was added to the polyamic acid solution, and 17 ml of N,N-dimethylacetamide was added, and stirred at room temperature for 2 hours to obtain a polyamic acid salt solution. Then, 1.0209 g (0.01 mol) of acetic anhydride and 0.791 (0.01 mol...

Embodiment 2

[0035] (1) prepare polyamic acid solution according to the method of step (1) in embodiment 1;

[0036] (2) 1.5499 g (0.012 mol) of isoquinoline was added to the polyamic acid solution, and 20 ml of N,N-dimethylacetamide was added, and stirred at room temperature for 2 hours to obtain a polyamic acid salt solution. Then add 0.8167 g (0.008 mol) of acetic anhydride and 0.6328 (0.008 mol) of pyridine to the solution, and stir at room temperature for 4 hours to obtain a polyamic acid salt-polyimide solution;

[0037] (3) Prepare a PI film according to the method of step (3) in Example 1.

Embodiment 3

[0039] (1) prepare polyamic acid solution according to the method of step (1) in embodiment 1;

[0040] (2) 1.8082 g (0.014 mol) of isoquinoline was added to the polyamic acid solution, and 23 ml of N,N-dimethylacetamide was added, and stirred at room temperature for 2 hours to obtain a polyamic acid salt solution. Then add 0.6125 g (0.006 mol) of acetic anhydride and 0.4746 (0.006 mol) of pyridine to the solution, and stir at room temperature for 4 hours to obtain a polyamic acid salt-polyimide solution;

[0041] (3) Prepare a PI film according to the method of step (3) in Example 1.

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PUM

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Abstract

The invention relates to the technical field of modification of organic polymer materials, in particular to a method for preparing a polyimide film with high elongation at break, comprising the following steps: preparing a polyamic acid solution by reacting dianhydride and diamine, and then Add organic base and polyamic acid for salt-forming reaction, then add dehydrating agent and catalyst for chemical imidization, and finally form polyimide solution through thermal imidization, and coat the polyimide solution on the support, The polyimide film is obtained by drying; the present invention adopts a simple polymerization method to improve the elongation at break of the polyimide film. While the performance does not decline, the toughness is greatly improved, and the elongation at break can be increased to more than 4 times.

Description

technical field [0001] The invention relates to the technical field of modification of organic polymer materials, in particular to a preparation method of a polyimide film with high elongation at break. Background technique [0002] Polyimide is an aromatic heterocyclic polymer compound containing an imide group in the repeating unit. It is one of the organic polymer materials with the best comprehensive properties. It has good mechanical properties, high temperature resistance, dimensional stability, resistance to Solvent, excellent electrical properties, etc., successfully used in aerospace, automobile manufacturing, electronic appliances, mechanical and chemical industries. [0003] With the development of science and technology, in addition to meeting the basic physical property requirements of various products, polyimide films also have special properties such as high strength, high toughness, wear resistance, high temperature resistance, and corrosion resistance. Shor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1071C08G73/1007C08J5/18C08J2379/08
Inventor 方省众张湲茗陈国飞王炳洋
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI