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Photo-electromagnetic response epoxy glass polymer

An epoxy-based, opto-electromagnetic technology, applied in the field of polymer materials

Pending Publication Date: 2021-06-18
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the epoxy glass polymer (vitrimer) with a single thermal response can only be repaired and plasticized under the condition of temperature stimulation, and cannot be repaired and plasticized under other external stimulation conditions of light, electricity and magnetism.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0021] The epoxy-type glass polymer (vitrimer) of photoelectromagnetic response of the present invention is made of 50-80 parts of epoxy resin, 20-40 parts of epoxy curing agent, 0 part of epoxy diluent, 5 parts of inorganic Filler and 5 parts of catalyst composition.

[0022] The epoxy resin is bisphenol A diglycidyl ether, the epoxy curing agent is sebacic acid, and the inorganic filler is Fe 3 o 4 Particles, the size of which is 20nm, the catalyst is triazabicyclic.

[0023] The photoelectromagnetic responsive epoxy vitrimer has thermal responsiveness, and can realize crack self-repair, welding and reprocessing at high temperature (100-300° C. and above).

[0024] The photoelectromagnetic response epoxy vitrimer has photoresponsiveness. Under the irradiation of 808nm infrared laser, the temperature of the material rises to 100-300°C and above in a short time, which can realize the self-repair of micro-cracks and show photoresponsiveness.

[0025] The photoelectromagnetic...

Embodiment 2

[0028] The epoxy-type glass macromolecule (vitrimer) of photoelectromagnetic response of the present invention is made of 50-80 parts of epoxy resin, 20-40 parts of epoxy curing agent, 10 parts of epoxy diluent, 5 parts of inorganic Filler and 5 parts of catalyst composition.

[0029] The epoxy resin is bisphenol A diglycidyl ether, the epoxy curing agent is adipic acid, the epoxy diluent is octyl glycidyl ether, and the inorganic filler is Fe 3 o 4 Particles, the size of which is 50nm, the catalyst is zinc acetate.

[0030] The photoelectromagnetic responsive epoxy vitrimer has thermal responsiveness, and can realize crack self-repair, welding and reprocessing at high temperature (100-300° C. and above).

[0031] The photoelectromagnetic response epoxy vitrimer has photoresponsiveness. Under the irradiation of 808nm infrared laser, the temperature of the material rises to 100-300°C and above in a short time, which can realize the self-repair of micro-cracks and show photore...

Embodiment 3

[0035] The epoxy-type glass macromolecule (vitrimer) of photoelectromagnetic response of the present invention consists of 80-100 parts of epoxy resin, 40-60 parts of epoxy curing agent, 10 parts of epoxy diluent, 10 parts of inorganic filler and 0 part catalyst composition;

[0036] The epoxy resin is bisphenol F diglycidyl ether, the epoxy curing agent is 4,4-dithiodibutyric acid, the epoxy diluent is phenyl glycidyl ether, and the inorganic filler for Fe 3 o 4 Particles, the size of which is 50nm.

[0037] The photoelectromagnetic responsive epoxy vitrimer has thermal responsiveness, and can realize crack self-repair, welding and reprocessing at high temperature (100-300° C. and above).

[0038] The photoelectromagnetic response epoxy vitrimer has photoresponsiveness. Under the irradiation of 808nm infrared laser, the temperature of the material rises to 100-300°C and above in a short time, which can realize the self-repair of micro-cracks and show photoresponsiveness.

...

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Abstract

The invention discloses a photo-electromagnetic response epoxy glass polymer which is prepared from the following components in parts by weight: 50-100 parts of epoxy resin, 20-60 parts of an epoxy curing agent, 0-30 parts of an epoxy diluent, 5-100 parts of inorganic filler and 0-5 parts of a catalyst. The photo-electromagnetic response epoxy glass polymer can drive reversible exchange reaction of dynamic ester bonds or disulfide bonds, exchange of polymer chain segments and recombination of a cross-linked network under specific laser, voltage / current or alternating magnetic fields, so that repair and welding of the epoxy glass polymer under various external stimulations of photo-electromagnetism are realized.

Description

technical field [0001] The invention belongs to the field of macromolecule materials, and in particular relates to an epoxy-type glass macromolecule with photoelectromagnetic response. Background technique [0002] Epoxy polymers, as a typical thermosetting polymer, have been widely used because of their excellent mechanical properties, excellent structural stability and good solvent resistance. However, when fully cured, the epoxy forms a three-dimensional cross-linked network, becoming a bulk cross-linked structure with a fixed shape and no further deformation. Unlike thermosetting polymers such as epoxy, thermoplastic polymers such as linear or branched polyethylene or polypropylene can be flowed and molded multiple times in solvents or at high temperatures, but their mechanical properties, structural stability, heat resistance and Solvent resistance is far inferior to thermoset polymers such as epoxy. [0003] In this paper, in order to make epoxy polymers take into ac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/22C08G59/42
CPCC08K3/22C08G59/4207C08G59/423C08K2003/2275C08K2201/011C08L63/00
Inventor 陈茂赵秀丽周琳吴冶平陈忠涛张银宇
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
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