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Preparation method for SnBi-series lead-free solder containing graphene and MAX phase

A lead-free solder and graphene technology, applied in the field of low-temperature soldering materials and electronic packaging, can solve problems such as premature failure

Pending Publication Date: 2021-06-22
XINJIANG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, it can also improve the corrosion resistance of solder alloys, improve the stability of solder joints, solve the problem of premature failure of interconnect solder joints in electronic products in complex service environments, and help prolong the service life of electronic products

Method used

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  • Preparation method for SnBi-series lead-free solder containing graphene and MAX phase
  • Preparation method for SnBi-series lead-free solder containing graphene and MAX phase

Examples

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Effect test

Embodiment 1

[0027] A kind of SnBi low-temperature lead-free solder containing graphene and MAX phase, in its composition, Sn58Bi, GNSs and Ti 3 AlC 2 The mass ratio is 99.87%: 0.03%: 0.1%. Wherein the thickness of graphene nanosheet is 1-5nm, Ti 3 AlC 2 The thickness of the tin-bismuth alloy is less than 1 μm, and the tin-bismuth alloy is a metal powder. In the powder, the mass percentage of tin is 42%, the mass percentage of bismuth is 58%, and the particle diameter of the powder is 30-60 μm.

Embodiment 2

[0029] A kind of SnBi low-temperature lead-free solder containing graphene and MAX phase, in its composition, Sn58Bi, GNSs and Ti 3 AlC 2 The mass ratio is 99.77%: 0.03%: 0.2%. Wherein the thickness of graphene nanosheet is 1-5nm, Ti 3 AlC 2 The thickness of the tin-bismuth alloy is less than 1 μm, and the tin-bismuth alloy is a metal powder. In the powder, the mass percentage of tin is 42%, the mass percentage of bismuth is 58%, and the particle diameter of the powder is 30-60 μm.

Embodiment 3

[0031] A kind of SnBi low-temperature lead-free solder containing graphene and MAX phase, in its composition, Sn58Bi, GNSs and Ti 3 AlC 2 The mass ratio is 99.47%: 0.03%: 0.5%. Wherein the thickness of graphene nanosheet is 1-5nm, Ti 3 AlC 2 The thickness of the tin-bismuth alloy is less than 1 μm, and the tin-bismuth alloy is a metal powder. In the powder, the mass percentage of tin is 42%, the mass percentage of bismuth is 58%, and the particle diameter of the powder is 30-60 μm.

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Abstract

The invention discloses a preparation method for an SnBi-series lead-free solder containing graphene and a MAX phase, and belongs to the technical field of low-temperature welding materials. The mass fraction of the graphene is 0-0.1%; the mass fraction of titanium aluminum carbide is 0-1.0%; and the balance is tin-bismuth binary eutectic alloy. The invention further discloses a preparation method for a lead-free solder. The brazing filler metal alloy is of an eutectic structure, is low in melting point, uniform in microstructure and good in wettability, does not contain toxic and harmful elements, is environment-friendly, and is suitable for the field of low-temperature soft soldering.

Description

technical field [0001] The invention belongs to the technical field of low-temperature welding materials, in particular to a welding material containing graphene nanosheets (GNSs) and titanium aluminum carbide (Ti 3 AlC 2 ) SnBi-based low-temperature lead-free solder preparation method, the lead-free solder is suitable for the field of electronic packaging, and can realize the connection function between connected materials. Background technique [0002] SnBi lead-free solder has the advantages of low melting point (138°C), high wettability, etc., and does not contain lead elements. It is an environmentally friendly solder and is suitable for low-temperature brazing. However, low plasticity hinders its wide application. In order to improve the comprehensive performance of the solder and improve its reliability during service, the researchers chose two methods of alloying and nanoparticle strengthening, and added different reinforcing phases to improve the comprehensive per...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/26B23K35/264B23K35/40
Inventor 马东亮李航行王佳林
Owner XINJIANG UNIVERSITY
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