Glue solution for coating television circuit board and preparation method of glue solution

A circuit board and coating technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of easy drying and hardening, poor heat resistance, reducing the protection effect of circuit boards, etc., to achieve uniform distribution, Guaranteed protection, enhanced flexibility and toughness

Active Publication Date: 2021-06-29
青岛汇元海泰电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing glue used for coating TV circuit boards has poor heat resistance, and it is easy to dry out and harden when used in a high temperature environment, reducing the protective effect on the circuit board

Method used

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  • Glue solution for coating television circuit board and preparation method of glue solution
  • Glue solution for coating television circuit board and preparation method of glue solution
  • Glue solution for coating television circuit board and preparation method of glue solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The invention provides a glue solution for coating a TV circuit board, which comprises a component A liquid and a B component liquid, and the A component liquid and the B component liquid are constituted according to a weight ratio of 10:1, and the The A component liquid includes: 48.56% epoxy resin, 5.64% curing agent, 2.15% pyrolytic graphite, 2.56% nano silicon dioxide, 41.09% organic solvent according to the weight percentage; the B component liquid Calculated by weight percentage, it includes: 56.64% polyurethane, 4.50% curing accelerator, 15.43% nanocellulose, 12.25% hexagonal boron nitride microchips, and 11.18% organic solvent;

[0029] The curing agent is dicyandiamide solution, the curing accelerator is 2-methylimidazole, and the organic solvent is N-methylpyrrolidone (NMP), ethylene glycol (EG), n-butanol, terpineol One or several compounded;

[0030] The present invention also provides a kind of preparation method of the glue solution for coating the TV cir...

Embodiment 2

[0041] The difference from Example 1 is that the A component liquid includes: 50.24% epoxy resin, 6.16% curing agent, 2.65% pyrolytic graphite, 2.74% nano silicon dioxide, 38.21% organic solvent; the B component liquid includes: 57.26% polyurethane, 5.30% curing accelerator, 17.57% nanocellulose, 12.65% hexagonal boron nitride microchips, 7.22% organic solvent .

Embodiment 3

[0043] All different from Examples 1-2, the A-component liquid includes: 49.40% epoxy resin, 5.90% curing agent, 2.40% pyrolytic graphite, 2.65% nano-silica , 39.65% organic solvent; the B component liquid includes: 56.95% polyurethane, 4.90% curing accelerator, 16.50% nanocellulose, 12.45% hexagonal boron nitride microchips, 9.20% of organic solvents.

[0044] Get the TV circuit board coating glue solution that above-mentioned embodiment 1-3 makes and the circuit board coating glue solution of control group one, the circuit board coating glue solution of control group two, the circuit board coating solution of control group three The glue solution for coating the board, the glue solution for the circuit board coating of the control group 4 and the glue solution for the circuit board coating of the control group 5, the glue solution for the circuit board coating of the control group 1 is an ordinary circuit board on the market Glue for coating, the glue for coating the circui...

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PUM

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Abstract

The invention discloses a glue solution for coating a television circuit board and a preparation method of the glue solution, and particularly relates to the technical field of circuit board glue solutions. The glue solution comprises a component A liquid and a component B. The component A liquid comprises epoxy resin, a curing agent, pyrolytic graphite, nano silicon dioxide and an organic solvent; and the component B liquid comprises polyurethane, a curing accelerator, nano cellulose, hexagonal boron nitride microchips and an organic solvent. The heat-resistant and high-temperature-resistant performance of the glue solution can be effectively improved, the toughness and flexibility of the glue solution in a high-temperature environment and the protection effect on a circuit board can be effectively guaranteed, the glue solution can be prevented from being dried up and hardened in the high-temperature environment when the circuit board is coated with the glue solution, double modification treatment can be effectively combined on the basis of effectively guaranteeing the performance of epoxy resin, on the basis of effectively ensuring the self performance of polyurethane, double modification treatment can be compounded, and the heat resistance and stability of the component A liquid and the component B liquid can be effectively enhanced.

Description

technical field [0001] The invention relates to the technical field of circuit board glue, more specifically, the invention relates to a glue for coating a TV circuit board and a preparation method thereof. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Circuit boards are very common in home appliances. The circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors, filling, electrical boundaries, etc. In the process of circuit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/04C09J11/08C09J11/04
CPCC09J163/00C09J11/08C09J11/04C08L2201/08C08L2203/206C08K2003/385C08K2201/011C08L75/04C08L1/02C08K3/38C08K3/04C08K7/26
Inventor 荆爱莲王明明
Owner 青岛汇元海泰电子有限公司
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