Low dielectric glass fiber and preparation method, glass fiber product, composite material and application

A glass fiber and composite material technology, which is applied in the fields of composite materials and applications, low dielectric glass fiber and preparation, and glass fiber products, can solve the problem of low dielectric constant and dielectric loss of glass fiber, high mechanical strength, and simple melting. and other problems, to achieve the effect of low wire drawing temperature, improved melting, and simple melting process

Active Publication Date: 2021-11-19
NANJING FIBERGLASS RES & DESIGN INST CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art that glass fibers cannot simultaneously have low dielectric constant and dielectric loss, simple melting, and high mechanical strength, so as to provide a low dielectric Glass fiber and preparation method, glass fiber product, composite material and application

Method used

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  • Low dielectric glass fiber and preparation method, glass fiber product, composite material and application
  • Low dielectric glass fiber and preparation method, glass fiber product, composite material and application
  • Low dielectric glass fiber and preparation method, glass fiber product, composite material and application

Examples

Experimental program
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Effect test

Embodiment 1-28

[0069] See Table 1 for the composition of low-dielectric glass fiber raw materials in Examples 1-28.

experiment example

[0083] The glass fibers obtained in the above examples are subjected to performance testing, and the specific testing items include: dielectric properties, bubble content, strength, modulus, liquidus temperature, and molding temperature (drawing temperature). The specific detection method is as follows:

[0084] Dielectric properties: The test uses glass block glass, which is prepared into glass batches according to the glass ratio, put into a platinum crucible, heated to 1500-1550°C in a resistance furnace, clarified for 24 hours, and then poured the glass liquid into the mold , for annealing. According to the test requirements, the glass is processed into a sample to be tested with a diameter of 60mm (±0.1mm), a thickness of 3mm (±0.1mm), and a smooth surface. According to the standard GB / T 5597, the dielectric constant and dielectric loss of glass samples are measured at 10GHz frequency by resonant cavity method.

[0085] Determination of bubble content: use glass blocks,...

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Abstract

The invention provides a low-dielectric glass fiber and its preparation method, glass fiber product, composite material and application. The invention reasonably adjusts the ratio of each oxide in the glass component to obtain high mechanical strength, good dielectric performance and melting Low-dielectric glass with excellent comprehensive performance such as simpler process. Specifically, by reasonably setting the ratio of silicon oxide, aluminum oxide and boron oxide, the glass fiber has a lower dielectric constant and dielectric loss, and the viscosity of the glass is properly adjusted. At the same time, considering the dielectric properties and mechanical strength Under the premise, through reasonable setting of alkaline earth metal oxides, alkali metal oxides, TiO 2 , CeO 2 and SnO 2 The dosage of the glass further improves the melting and clarifying performance of the glass, the temperature of the wire drawing is lower, the stability and yield are higher, the density is lower, and it has excellent workability.

Description

technical field [0001] The invention belongs to the technical field of glass fiber, and in particular relates to a low-dielectric glass fiber and a preparation method, a glass fiber product, a composite material and an application. Background technique [0002] Modern electronic devices often include printed circuit boards reinforced with fiberglass. The two types of glass fibers commonly used to reinforce printed circuit boards are E glass and D glass. Among them, alkali-free and low-dielectric E-glass fiber is the most widely used, and the production and preparation are simple and the price is low. However, at room temperature and a frequency of about 10 GHz, E-glass has a higher dielectric constant of about 6.1 and about 38×10 -4 The high loss factor of the high-performance, high-integrated electronic circuit field has been unable to meet the requirements. Compared with E glass fiber, D glass fiber has excellent dielectric properties, the dielectric constant is less th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C13/02D03D15/267D04H1/4218D04H3/004D04H5/12D02G3/18H01B3/08H05K1/03H05K5/02
CPCC03C13/00D04H1/4218D04H3/004D04H5/12D02G3/18H01B3/087H05K1/0306H05K5/0217D10B2101/06
Inventor 郭仁贤黄三喜黄松林祖群
Owner NANJING FIBERGLASS RES & DESIGN INST CO LTD
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