Terahertz metamaterial sensor and application thereof
A metamaterial and sensor technology, applied in the field of terahertz spectroscopy, can solve problems such as time-consuming, complicated operation, and generation of hazardous waste, and achieve the effects of reducing loss, improving sensing sensitivity, and facilitating detection
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[0033] The present invention also provides a method for preparing the above-mentioned terahertz metamaterial sensor, including: preparing a flexible substrate; spin-coating photoresist on the flexible substrate, and then processing the designed mask pattern by using a photolithography process, and then depositing A thin layer of metal, and then remove the photoresist, to get a terahertz metamaterial sensor.
[0034] The flexible substrate of the metamaterial sensor provided by the present invention preferably adopts polyimide film, and the asymmetric ring structure adopts gold material, and its preparation process preferably specifically includes:
[0035] (1) Silicon substrate surface cleaning. In order to ensure that the surface of the silicon substrate is clean and the polyimide solution is firmly attached to the silicon wafer, the silicon surface must first be ultrasonically cleaned with acetone, alcohol, and deionized water.
[0036](2) spin coating polyimide solution. ...
Embodiment 1
[0046] 1. Preparation of metamaterial sensors
[0047] The flexible substrate of the metamaterial sensor designed in the present invention adopts polyimide film, and the periodic structure adopts gold material, and its preparation process includes: (1) cleaning the surface of the silicon substrate. In order to ensure that the surface of the silicon substrate is clean and the polyimide solution is firmly attached to the silicon wafer, the silicon surface must first be ultrasonically cleaned with acetone, alcohol, and deionized water. (2) spin coating polyimide solution. A 25 micron thick polyimide film was coated on a silicon wafer by spin coating. (3) Curing. In order to volatilize all the moisture in the polyimide solution and make the solution solidify and adhere to the silicon substrate, the spin-coated polyimide solution is placed in a vacuum oven for curing. (4) Remove the silicon substrate. The polyimide film is peeled off from the silicon substrate by utilizing the ...
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