Preparation method of novel extruded polystyrene thermal insulation material/mortar covalent bonding system

A technology of extruded polystyrene and thermal insulation materials, applied in the direction of coating, etc., can solve the problems of difficult control of construction quality and falling off of thermal insulation projects, and achieve the goals of facilitating construction quality control, improving bonding strength, and shortening on-site construction technology Effect

Active Publication Date: 2021-07-23
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on-site construction quality is difficult to control, and accidents of insulation engineering falling off are still common

Method used

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  • Preparation method of novel extruded polystyrene thermal insulation material/mortar covalent bonding system
  • Preparation method of novel extruded polystyrene thermal insulation material/mortar covalent bonding system
  • Preparation method of novel extruded polystyrene thermal insulation material/mortar covalent bonding system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Cut XPS into blocks of 50mm*50mm*50mm for use. Put some XPS plates into the UVO device, set the irradiation time to 7min, adjust the irradiation distance to 9cm, and perform UVO surface activation. At the same time, prepare 0.5 mL (concentration: 2%) of γ-aminopropyltriethoxysilane (KH550) coupling agent solution (the solution is in an alkaline environment), and slowly and evenly drop it onto the surface of the activated XPS plate. The surface coupling reaction was carried out by UVO irradiation again, the irradiation time was 3min, and the irradiation distance was 9cm. After the reaction, the surface of the XPS plate was washed three times with deionized water, and dried in an oven at 40° C. for 15 minutes. Subsequently, apply the evenly stirred plaster mortar on the modified surface of the dried KH550-XPS board, and the thickness of the mortar is controlled at 3mm. The bonding strength test was carried out after curing for seven days under the standard curing condit...

Embodiment 2

[0032] The acidity and alkalinity of the coupling agent solution not only affects the hydrolysis rate of the coupling agent, but also affects the electronegativity of the amino group in the KH550 structure, thereby affecting its reaction characteristics with the activated XPS plate. Therefore, embodiment 2 changes the acidity and alkalinity of the solution.

[0033] Cut XPS into blocks of 50mm*50mm*50mm for use. Put some XPS plates into the UVO device, set the irradiation time to 7min, adjust the irradiation distance to 9cm, and perform UVO surface activation. At the same time, prepare 0.5mL (concentration: 2%) of γ-aminopropyltriethoxysilane (KH550) coupling agent solution (the solution is acidic or neutral environment), and slowly and evenly drop it on the surface of the activated XPS plate . The surface coupling reaction was carried out by UVO irradiation again, the irradiation time was 3min, and the irradiation distance was 9cm. After the reaction, the surface of the XP...

Embodiment 3

[0037] Cut XPS into blocks of 50mm*50mm*50mm for use. Put some XPS plates into the UVO device, set the irradiation time to 10min, adjust the irradiation distance to 9cm, and perform UVO surface activation. At the same time, prepare 0.5mL (concentration: 2%) of γ-mercaptopropyltrimethoxysilane (KH590) coupling agent solution (the solution is in an acidic, neutral or alkaline environment), and slowly and evenly add it dropwise to the activated XPS plate surface for interfacial coupling reaction. After the end, the surface of the XPS plate was washed three times with deionized water, and dried in an oven at 40°C for 15 minutes. Subsequently, apply the evenly stirred plaster mortar on the modified surface of the dried KH590-XPS board, and the thickness of the mortar is controlled at 3mm. The bonding strength test was carried out after curing for seven days under the standard curing conditions of temperature 20±5°C and humidity 40%-60%. The bonding strength between KH550-XPS and...

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Abstract

The invention relates to an extruded polystyrene (XPS) insulation board / mortar insulation system combined in a covalent bonding mode. The method comprises the following steps: activating an XPS plate by utilizing an ultraviolet-ozone radiation method; enabling organic functional groups in the silane coupling agent to react with the activated XPS surface, thereby achieving the coupling modification of XPS. And the selected silane coupling agent comprises gamma-aminopropyl triethoxy silane, gamma-mercaptopropyl trimethoxy silane, vinyl triethoxy silane and the like. Covalent bonding between the organic XPS board and the inorganic mortar is realized by utilizing the amphipathicity of the silane coupling agent. In one embodiment, the bond strength between the interface coupled XPS board and mortar is enhanced by 158.6%.

Description

technical field [0001] The invention relates to the field of building energy conservation, and specifically refers to the realization of covalent bonding between an organic thermal insulation board and an inorganic mortar. Background technique [0002] Extruded polystyrene insulation material (XPS) has excellent thermal and mechanical properties, and is widely used in the field of building energy conservation in my country. It fixes the upper wall by bonding with inorganic mortar. However, the XPS surface is smooth and has a closed-cell structure, which cannot be effectively infiltrated with the mortar, resulting in weak interfacial bonding between the two. At present, the main solution is to improve the interface strength to a certain extent by increasing the surface roughness and manually brushing the interface agent on the construction site and other physical methods. However, it is difficult to control the quality of on-site construction, and accidents of insulation en...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/12C08J7/06C08L25/06
CPCC08J7/123C08J7/12C08J7/06C08J2325/06
Inventor 张瑶金晓冬孙诗兵
Owner BEIJING UNIV OF TECH
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