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Preparation method of high-heat-resistance oxygen-free copper

An oxygen-free copper, high heat-resistant technology, applied in the field of copper alloy materials, can solve the problems that the hardness and conductivity need to be further improved

Inactive Publication Date: 2021-07-30
安徽绿能技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, its hardness and conductivity need to be further improved

Method used

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  • Preparation method of high-heat-resistance oxygen-free copper

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[0013] A method of preparation of high heat resistant anti-oxygen-free copper, including:

[0014] Step S1, smelting: Insert an oxygen-free electrolytic copper, Cu-SE intermediate alloy, Cu-Y intermediate alloy, Cu-NB intermediate alloy, Cu-S intermediate alloy, Cu-SC intermediate alloy, Cu-S intermediate alloy, Cu-SC intermediate alloy, add cover And refining agents, using suspension mixed and emission slag, introduction of inert gas, smelting in an inert gas atmosphere to obtain melt;

[0015] Preferably, the oxygen-free electrolytic copper, Cu-SE intermediate alloy, Cu-Y intermediate alloy, Cu-NB intermediate alloy, Cu-S intermediate alloy, the weight ratio of Cu-SC intermediate alloy is 100: (0.01-0.03) : (0.03-0.05) :( 0.02-0.04) :( 0.06-0.1) :( 0.01-0.04).

[0016] Preferably, the weight percentage of SE in the Cu-SE intermediate alloy is 6-13%; the particle size is 300-500 mesh.

[0017] Preferably, the weight percentage of y in the intermediate alloy in the Cu-Y intermedia...

Embodiment 1

[0035] A method of preparation of high heat resistant anti-oxygen-free copper, including:

[0036] Step S1, smelting: Insert an oxygen-free electrolytic copper, Cu-SE intermediate alloy, Cu-Y intermediate alloy, Cu-NB intermediate alloy, Cu-S intermediate alloy, Cu-SC intermediate alloy, Cu-S intermediate alloy, Cu-SC intermediate alloy, add cover And refining agents, using suspension mixed and emission slag, introduction of inert gas, smelting in an inert gas atmosphere to obtain melt;

[0037] Oxygen-free electrolytic copper, Cu-SE intermediate alloy, Cu-Y intermediate alloy, Cu-Si intermediate alloy, Cu-SC intermediate alloy weight ratio of 100: 0.01: 0.03: 0.02: 0.06: 0.01; The weight percentage of SE in the Cu-SE intermediate alloy is 6%; the particle diameter is 300 mesh; the weight percentage content in the Cu-Y intermediate alloy is 15%; the particle size is 200 mesh; The weight percentage of Nb in the Cu-Nb intermediate alloy is 5%; the particle diameter is 100 mesh; the ...

Embodiment 2

[0044] A method of preparation of high heat resistant anti-oxygen-free copper, including:

[0045] Step S1, smelting: Insert an oxygen-free electrolytic copper, Cu-SE intermediate alloy, Cu-Y intermediate alloy, Cu-NB intermediate alloy, Cu-S intermediate alloy, Cu-SC intermediate alloy, Cu-S intermediate alloy, Cu-SC intermediate alloy, add cover And refining agents, using suspension mixed and emission slag, introduction of inert gas, smelting in an inert gas atmosphere to obtain melt;

[0046] Preferably, the oxygen-free electrolytic copper, Cu-SE intermediate alloy, Cu-Y intermediate alloy, Cu-NB intermediate alloy, Cu-Si intermediate alloy, and Cu-SC intermediate alloy weight ratio is 100: 0.015: 0.035: 0.025 : 0.07: 0.02; The weight percentage of SE in the Cu-SE intermediate alloy is 8%; the particle diameter is 350; the weight percentage content in the Cu-Y intermediate alloy is 17%; the particle size is 250. The weight percentage content of Nb in the Cu-Nb intermediate allo...

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Abstract

The invention discloses a preparation method of high-heat-resistance oxygen-free copper. The method is characterized by comprising the following steps: S1, smelting; S2, casting; and S3, homogenization treatment and heat treatment, specifically, a cast ingot prepared in step S2 is subjected to homogenization treatment, and then normalizing treatment, tempering treatment and quenching treatment are conducted in sequence to obtain the high-heat-resistance oxygen-free copper finished product. The invention further discloses the high-heat-resistance oxygen-free copper prepared according to the preparation method of the high-heat-resistance oxygen-free copper and application of the high-heat-resistance oxygen-free copper in the electrical and electronic field and heat-resistant materials. The high-heat-resistance oxygen-free copper disclosed by the invention is good in hardness and conductivity and excellent in heat resistance. The preparation method is low in equipment input, simple in process, convenient to implement and control, and suitable for continuous large-scale production.

Description

Technical field [0001] The present invention relates to the technical field of copper alloy materials, and more particularly to a method for preparing high heat resistant oxygenless copper. Background technique [0002] In recent years, with the progress and economic development of science and technology, new energy vehicles have emerged as the spring bamboo shoots, bringing great convenience to people, effectively reduces environmental pollution, driving oxygen-free preparation technology. Oxygenless copper is an important material for preparing new energy vehicle power module circuit board and its peripheral components. Since it overcomes the disadvantages of impurity copper with lower yield strength after annealing, the flexible creep is high, with higher strength and more High thermal conductivity is highly valued by electronic materials experts. [0003] With the development of electronic communication, navigation control, electricity, microgramid and power electron transpor...

Claims

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Application Information

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IPC IPC(8): C22C1/03C22C1/06C22F1/08C22C9/00
CPCC22C1/03C22C1/06C22C9/00C22F1/002C22F1/08
Inventor 夏伟刘龙龙周波
Owner 安徽绿能技术研究院有限公司