Check patentability & draft patents in minutes with Patsnap Eureka AI!

Polyimide precursor composition and polyimide film/substrate laminate

A polyimide precursor, polyimide film technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problem that the flexible film is difficult to maintain planarity, and achieve excellent stability , excellent storage stability, excellent transparency effect

Active Publication Date: 2021-08-03
UBE IND LTD
View PDF12 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In general, it is difficult to maintain flatness of a flexible film, so it is difficult to uniformly and precisely form semiconductor elements such as TFTs, fine wiring, etc. on a flexible film

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyimide precursor composition and polyimide film/substrate laminate
  • Polyimide precursor composition and polyimide film/substrate laminate
  • Polyimide precursor composition and polyimide film/substrate laminate

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0218] The polyimide precursor composition can be prepared by adding and mixing an imidazole compound or a solution of an imidazole compound to the polyimide precursor solution obtained by the above method. A tetracarboxylic-acid component and a diamine component can also be made to react in presence of an imidazole compound.

[0219] >

[0220] The polyimide film / substrate laminate of the present invention can be manufactured through the following steps: (a) the step of applying the polyimide precursor composition to the substrate; (b) applying the polyimide precursor composition to the substrate The process of heat-processing the said polyimide precursor, and manufacturing the laminated body (polyimide film / substrate laminated body) in which the polyimide film was laminated|stacked on the said base material. The manufacturing method of the flexible electronic device of the present invention uses the polyimide film / substrate laminate produced by the above-mentioned step (a) ...

Embodiment 1

[0336] [Preparation of polyimide precursor composition]

[0337] 2.27 g (0.010 mol) of DABAN was added to a reaction vessel replaced with nitrogen, and 32.11 g of N-methyl-2 - Pyrrolidone, stirred at 50°C for 1 hour. 3.84 g (0.010 mol) of CpODA was slowly added to this solution. It was stirred at 70°C for 4 hours to obtain a uniform and viscous polyimide precursor solution.

[0338] 2-Phenylimidazole, which is an imidazole compound, was dissolved in 4 times the mass of N-methyl-2-pyrrolidone to obtain a uniform solution with a solid content concentration of 20% by mass of 2-phenylimidazole. The solution of the imidazole compound and the polyimide precursor solution synthesized above were stirred at room temperature for 3 hours to obtain a uniform and Viscous polyimide precursor composition.

[0339] [Manufacture of polyimide film / substrate laminate]

[0340] In order to manufacture the polyimide film / base material laminated body for polyimide film evaluation, the Eagle-...

Embodiment 2～15、 comparative example 1～14

[0345] In Example 1, except that the tetracarboxylic acid component, the diamine component, the imidazole compound, and the maximum temperature during film formation were changed to the compounds shown in Table 2 to Table 5, polyimide was produced in the same manner as in Example 1. For the amine film / reference base material laminate, the warpage of the laminate was measured in the same manner as in Example 1, and the residual stress at 23° C. was obtained. The results are shown in Tables 2 to 5. In addition, in Table 2 to Table 4, the polyimide film / substrate using the sixth generation glass substrate (Eagle-XG (registered trademark) 500 μm thick, elastic modulus: 73.6 GPa) is also shown together. The estimated warpage value of the laminate.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

[Problem] The purpose of the present invention is to provide a polyimide precursor composition which is capable of producing a polyimide film / substrate laminate having little warpage and which has excellent stability; also provided are a polyimide film / substrate laminate and a method for manufacturing a flexible electronic device. [Solution] A polyimide precursor composition is characterized by containing a polyimide precursor represented by general formula (I); at least one imidazole compound selected from the group consisting of 2-phenylimidazole and benzimidazole and contained in an amount in the range of more than 0.01 mol and less than 1 mol per 1 mol of repeating units of the polyimide precursor; and a solvent. (In general formula I, 70 mol% or more of X1 represents a structure represented by formula (1-1), and 70 mol% or more of Y1 represents a structure represented by formula (D-1) and / or (D-2).

Description

technical field [0001] The present invention relates to a polyimide precursor composition suitable for use in electronic devices such as substrates for flexible devices, and a warpage-reduced polyimide film / substrate laminate. In addition, it relates to a method of manufacturing a flexible electronic device using the above-mentioned composition. Background technique [0002] Polyimide films are widely used in fields such as electric / electronic device fields and semiconductor fields due to their excellent heat resistance, chemical resistance, mechanical strength, electrical properties, dimensional stability, and the like. On the other hand, in recent years, with the advent of an advanced information society, the development of optical materials such as optical fibers and optical waveguides in the field of optical communications, and liquid crystal alignment films and protective films for color filters in the field of display devices has been promoted. In particular, in the f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K5/3445C08K5/3447C08J5/18H01L27/12H01L21/77G01L5/00
CPCC08K5/3445C08K5/3447C08J5/18H01L27/1218H01L27/1266G01L5/0047C08J2379/08C08L2203/16C08L79/08
Inventor 冈卓也小滨幸德
Owner UBE IND LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com