High-thermal-conductivity adhesive film and preparation method thereof

Abstract

The invention discloses a high-thermal-conductivity adhesive film and a preparation method thereof. The preparation method comprises the following steps: 1, modified epoxy resin is stirred and mixed through a mixing device to be prepared into gel; 2, aluminum nitride and boron nitride are put into the mixing device and mixed with the colloidal modified epoxy resin, and an adhesive film mixture is prepared; 3, the adhesive film mixture is placed in a coating device to be coated into a film shape, and an adhesive film layer composed of a modified epoxy resin adhesive layer, an aluminum nitride filler layer and a boron nitride filler layer is prepared; and 4, the adhesive film semi-finished product is flattened through a flattening mechanism. In the preparation process, the prepared high-thermal-conductivity adhesive film and the cured adhesive film are high in overall thermal conductivity and good in heat resistance so that the adhesive film can better meet the use of a corresponding high-thermal-conductivity material structure, the situation that the adhesive film is influenced in the operation period after modification is avoided, the high-thermal-conductivity operation requirement is better met, and popularization and use are realized.

Description

technical field [0001] The invention relates to the technical field of high thermal conductivity adhesive film preparation, in particular to a high thermal conductivity adhesive film and a preparation method thereof. Background technique [0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. Very few applications are multi-layer boards, which can be made by laminating ordinary multi-layer boards with insulating layers and aluminum bases; [0003] With the rapid development of microelectronics integration technology, the power requirements of electronic products for components are getting higher and...

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of traditional copper clad laminates is relatively low, which cannot meet the needs of high thermal conductivity. At present, some high thermal conductivity adhesive film copper clad laminates still have certain deficiencies during operation. The traditional metal substrates The overall thermal conductivity of the film is still relatively deficient, resulting in aging of the metal substrate after long-term operation, which reduces the overall service life, and the overall thermal conductivity still needs to be improved.

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