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A method for preparing epoxy resin composite material from recycled circuit board materials

A technology of epoxy resin and composite materials, which is applied in the direction of plastic recycling and recycling technology, and can solve the problems of limiting the scope of application of conductive epoxy resin, complicated preparation methods, and high cost

Active Publication Date: 2022-05-31
安徽绿洲危险废物综合利用有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy resin itself is a linear polymer. Depending on the structure and molecular weight, it is liquid or solid at room temperature, soluble in a variety of organic solvents, and undergoes a cross-linking reaction with a curing agent to form a cross-linked thermosetting resin. Plastics and conductive materials are mostly carbon-containing inorganic materials such as carbon black, graphene, carbon nanotubes, etc., but the preparation method is complicated and costly, which limits the scope of application of conductive epoxy resins. Therefore, metals recovered from printed circuit boards are used as The conductive component of conductive epoxy resin has the advantages of environmental protection, energy saving and economy, but solving the compatibility between multi-metal and epoxy resin is one of the problems that need to be solved

Method used

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  • A method for preparing epoxy resin composite material from recycled circuit board materials
  • A method for preparing epoxy resin composite material from recycled circuit board materials
  • A method for preparing epoxy resin composite material from recycled circuit board materials

Examples

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Embodiment 1

[0032] A method for preparing an epoxy resin composite material from recycled circuit board materials, wherein the epoxy resin composite material prepared from recycled circuit board materials includes the following raw materials in parts by weight:

[0033] 20 parts of circuit board recycling material, 30 parts of epoxy resin prepolymer, 10 parts of curing agent;

[0034] The epoxy resin composite material prepared from the circuit board reclaimed material is made by the following steps:

[0035] Step A1, breaking the recycled circuit board material into small pieces, putting it into a 10% sodium hydroxide solution by mass, boiling it, washing it twice with deionized water, drying it at 80°C for 3 hours, and soaking it in an acidic solution After 4 hours, the soaking solution was obtained, and then hydrometallurgy was carried out to obtain metal compound precipitation from the soaking solution;

[0036] Step A2, put the metal compound precipitation and sulfur powder prepared...

Embodiment 2

[0049] A method for preparing an epoxy resin composite material from recycled circuit board materials, wherein the epoxy resin composite material prepared from recycled circuit board materials includes the following raw materials in parts by weight:

[0050] 25 parts of recycled circuit board, 35 parts of epoxy resin prepolymer, 15 parts of curing agent;

[0051] The epoxy resin composite material prepared from the circuit board reclaimed material is made by the following steps:

[0052] Step A1, break the recycled circuit board material into small pieces, put it into a 10% sodium hydroxide solution by mass, boil it, wash it twice with deionized water, dry it at 85°C for 3 hours, and soak it in an acidic solution After 4 hours, the soaking solution was obtained, and then hydrometallurgy was carried out to obtain metal compound precipitation from the soaking solution;

[0053] Step A2, put the metal compound precipitate and sulfur powder prepared in step A1 into a flask, add D...

Embodiment 3

[0066] A method for preparing an epoxy resin composite material from recycled circuit board materials, wherein the epoxy resin composite material prepared from recycled circuit board materials includes the following raw materials in parts by weight:

[0067] 30 parts of circuit board recycling material, 40 parts of epoxy resin prepolymer, 20 parts of curing agent;

[0068] The epoxy resin composite material prepared from the circuit board reclaimed material is made by the following steps:

[0069] Step A1, break the recycled circuit board material into small pieces, boil it in a 10% sodium hydroxide solution, wash it three times with deionized water, dry it at 90°C for 4 hours, and soak it in an acidic solution After 5 hours, the soaking solution was obtained, and then hydrometallurgy was carried out to obtain metal compound precipitation from the soaking solution;

[0070] Step A2, put the metal compound precipitate and sulfur powder prepared in step A1 into a flask, add DMF...

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PUM

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Abstract

The invention discloses a method for preparing epoxy resin composite materials from recycled circuit board materials, comprising raw materials, 20-30 parts of circuit board recycled materials, 30-40 parts of epoxy resin prepolymer, and 10-20 parts of curing agent; The method, step A1, breaks the recovered material of the circuit board into small pieces, boils it in a sodium hydroxide solution, washes and dries it with water, then soaks it in an acidic solution, and then carries out a hydrometallurgical method to obtain a metal compound precipitation from the soaking solution ; Step A2, put the metal compound precipitation and sulfur powder into the flask, add DMF, stir until dissolved, add the mixed solution of triethylenetetramine and ethylenediamine and polyvinylpyrrolidone, in a nitrogen atmosphere at 150‑160 °C Reflux reaction for 5-6 hours to prepare modified nanocrystals; step A3, heating the epoxy resin prepolymer to a molten state, adding modified nanocrystals and curing agent for 3-4 hours to prepare epoxy resin composite material .

Description

technical field [0001] The invention belongs to the technical field of polymer material preparation, and relates to a method for preparing epoxy resin composite materials from recycled circuit board materials. Background technique [0002] Printed circuit board (PCB) is an important part of electronic components. It not only contains a large amount of valuable metals such as copper, tin, gold, and silver; it also contains heavy metals such as lead and cadmium, and toxic , Harmful substances, if the waste printed circuit boards are not treated or handled improperly, it will not only cause a waste of metal resources, but also pollute the environment. The existing technology often uses hydrometallurgy to recover metals, which not only has a high recovery rate, but also No toxic and harmful gases such as dioxins that pollute the atmosphere will be produced in the process, but how to use the recovered metals has always been a problem that the industry needs to solve. [0003] Co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/30C08K9/10
CPCC08K3/30C08K9/10C08K2201/001C08K2201/011C08L63/00Y02W30/62
Inventor 袁胜巧韩秀东
Owner 安徽绿洲危险废物综合利用有限公司
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