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Method for preparing epoxy resin composite material from circuit board reclaimed material

A technology of epoxy resin and composite materials, applied in the direction of plastic recycling, recycling technology, etc., can solve the problems of complicated preparation methods, high cost, and limited application range of conductive epoxy resin

Active Publication Date: 2021-08-06
安徽绿洲危险废物综合利用有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy resin itself is a linear polymer. Depending on the structure and molecular weight, it is liquid or solid at room temperature, soluble in a variety of organic solvents, and undergoes a cross-linking reaction with a curing agent to form a cross-linked thermosetting resin. Plastics and conductive materials are mostly carbon-containing inorganic materials such as carbon black, graphene, carbon nanotubes, etc., but the preparation method is complicated and costly, which limits the scope of application of conductive epoxy resins. Therefore, metals recovered from printed circuit boards are used as The conductive component of conductive epoxy resin has the advantages of environmental protection, energy saving and economy, but solving the compatibility between multi-metal and epoxy resin is one of the problems that need to be solved

Method used

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  • Method for preparing epoxy resin composite material from circuit board reclaimed material
  • Method for preparing epoxy resin composite material from circuit board reclaimed material
  • Method for preparing epoxy resin composite material from circuit board reclaimed material

Examples

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Embodiment 1

[0032] A method for preparing an epoxy resin composite material from recycled circuit board materials, wherein the epoxy resin composite material prepared from recycled circuit board materials includes the following raw materials in parts by weight:

[0033] 20 parts of circuit board recycling material, 30 parts of epoxy resin prepolymer, 10 parts of curing agent;

[0034] The epoxy resin composite material prepared from the circuit board reclaimed material is made by the following steps:

[0035] Step A1, breaking the recycled circuit board material into small pieces, putting it into a 10% sodium hydroxide solution by mass, boiling it, washing it twice with deionized water, drying it at 80°C for 3 hours, and soaking it in an acidic solution After 4 hours, the soaking solution was obtained, and then hydrometallurgy was carried out to obtain metal compound precipitation from the soaking solution;

[0036] Step A2, put the metal compound precipitation and sulfur powder prepared...

Embodiment 2

[0049] A method for preparing an epoxy resin composite material from recycled circuit board materials, wherein the epoxy resin composite material prepared from recycled circuit board materials includes the following raw materials in parts by weight:

[0050] 25 parts of recycled circuit board, 35 parts of epoxy resin prepolymer, 15 parts of curing agent;

[0051] The epoxy resin composite material prepared from the circuit board reclaimed material is made by the following steps:

[0052] Step A1, break the recycled circuit board material into small pieces, put it into a 10% sodium hydroxide solution by mass, boil it, wash it twice with deionized water, dry it at 85°C for 3 hours, and soak it in an acidic solution After 4 hours, the soaking solution was obtained, and then hydrometallurgy was carried out to obtain metal compound precipitation from the soaking solution;

[0053] Step A2, put the metal compound precipitate and sulfur powder prepared in step A1 into a flask, add D...

Embodiment 3

[0066] A method for preparing an epoxy resin composite material from recycled circuit board materials, wherein the epoxy resin composite material prepared from recycled circuit board materials includes the following raw materials in parts by weight:

[0067] 30 parts of circuit board recycling material, 40 parts of epoxy resin prepolymer, 20 parts of curing agent;

[0068] The epoxy resin composite material prepared from the circuit board reclaimed material is made by the following steps:

[0069] Step A1, break the recycled circuit board material into small pieces, boil it in a 10% sodium hydroxide solution, wash it three times with deionized water, dry it at 90°C for 4 hours, and soak it in an acidic solution After 5 hours, the soaking solution was obtained, and then hydrometallurgy was carried out to obtain metal compound precipitation from the soaking solution;

[0070] Step A2, put the metal compound precipitate and sulfur powder prepared in step A1 into a flask, add DMF...

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Abstract

The invention discloses a method for preparing an epoxy resin composite material from a circuit board reclaimed material. The epoxy resin composite material comprises the following raw materials: 20-30 parts of the circuit board reclaimed material, 30-40 parts of an epoxy resin prepolymer and 10-20 parts of a curing agent. The method comprises the following steps: A1, crushing the circuit board reclaimed material into small blocks, boiling in a sodium hydroxide solution, washing with water, drying, soaking in an acid solution, and preparing a metal compound precipitate from a soaking solution by a hydrometallurgy method; A2, putting the metal compound precipitate and sulfur powder into a flask, adding DMF, stirring until the metal compound precipitate and the sulfur powder are dissolved, adding a mixed solution of triethylene tetramine and ethylenediamine and polyvinylpyrrolidone, and performing reflux reaction for 5-6 hours at 150-160 DEG C in a nitrogen atmosphere to prepare modified nanocrystals; and step A3, heating the epoxy resin prepolymer to a molten state, adding the modified nanocrystals and a curing agent, and curing for 3-4 hours to prepare the epoxy resin composite material.

Description

technical field [0001] The invention belongs to the technical field of polymer material preparation, and relates to a method for preparing epoxy resin composite materials from recycled circuit board materials. Background technique [0002] Printed circuit board (PCB) is an important part of electronic components. It not only contains a large amount of valuable metals such as copper, tin, gold, and silver; it also contains heavy metals such as lead and cadmium, and toxic , Harmful substances, if the waste printed circuit boards are not treated or handled improperly, it will not only cause a waste of metal resources, but also pollute the environment. The existing technology often uses hydrometallurgy to recover metals, which not only has a high recovery rate, but also No toxic and harmful gases such as dioxins that pollute the atmosphere will be produced in the process, but how to use the recovered metals has always been a problem that the industry needs to solve. [0003] Co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/30C08K9/10
CPCC08K3/30C08K9/10C08K2201/001C08K2201/011C08L63/00Y02W30/62
Inventor 袁胜巧韩秀东
Owner 安徽绿洲危险废物综合利用有限公司
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