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Oligomeric organosilicon anti-ultraviolet epoxy resin LED packaging adhesive

A technology of LED encapsulation and epoxy resin, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of UV instability and achieve good effect of high temperature resistance

Inactive Publication Date: 2021-08-06
SHANGHAI INST OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a kind of oligomeric organosilicon anti-ultraviolet epoxy resin LED packaging adhesive, which better solves the problem that most existing packaging adhesives are unstable to ultraviolet rays, and has better light transmittance and Mechanical properties, while taking into account environmental protection, no pungent smell

Method used

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  • Oligomeric organosilicon anti-ultraviolet epoxy resin LED packaging adhesive
  • Oligomeric organosilicon anti-ultraviolet epoxy resin LED packaging adhesive

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Embodiment 1

[0025] This embodiment provides an oligomeric organic silicon anti-ultraviolet epoxy resin LED encapsulation adhesive, including A component and B component, A component and B component are mixed at a ratio of 1:1 for LED encapsulation;

[0026] A component includes epoxy silicone oligomer, alicyclic epoxy resin, reactive diluent, crosslinking agent, transparent blue-violet dye paste and defoamer, wherein the mass fraction of epoxy silicone oligomer 50% to 55%, the mass fraction of cycloaliphatic epoxy resin is 40% to 50%, the mass fraction of reactive diluent is 1% to 4%, the mass fraction of crosslinking agent is 0.5% to 1.5%, transparent The mass fraction of the blue-violet dye paste is 0.2% to 0.8%, and the mass fraction of the defoamer is 0.2% to 0.5%;

[0027] In this embodiment, the cycloaliphatic epoxy resin is 3,4-epoxycyclohexylmethyl 3', 4'-epoxycyclohexyl carboxylate, bis((3,4-epoxycyclohexyl) methyl base) adipate and 4,5-epoxycyclohexane-1,2-dicarboxylate diglyci...

Embodiment 2

[0035] This embodiment provides an oligomeric silicone anti-ultraviolet epoxy resin LED encapsulant, including A component and B component;

[0036] The preparation method process of A component is as follows:

[0037] First prepare the epoxy silicone oligomer in component A, and prepare it according to the following steps: (1) 3-(2,3 glycidoxy)propyltrimethoxysilane and dimethoxysilane with a molar ratio of 1:1 Methyldimethoxysilane is added in dehydrated alcohol, and the volume ratio of the amount of substance of 3-(2,3 glycidoxy) propyltrimethoxysilane and dehydrated alcohol is 1mol:800mL; (2) Then add distilled water to the solution obtained in the previous steps, react at a temperature of 60°C for 10 hours, and finally use a rotary evaporator to remove the solvent to obtain an epoxy silicone oligomer, the molar ratio of distilled water to dimethyldimethoxysilane 1:0.9;

[0038] Then the mass fraction is 50% epoxy silicone oligomer, 45% 3,4-epoxycyclohexylmethyl 3',4'-ep...

Embodiment 3

[0042] This embodiment provides an oligomeric silicone anti-ultraviolet epoxy resin LED encapsulant, including A component and B component;

[0043] The preparation method process of A component is as follows:

[0044] First prepare the epoxy silicone oligomer in component A, and prepare it according to the following steps: (1) 3-(2,3 glycidoxy)propyltriethoxysilane with a molar ratio of 1:1 Methylphenyldimethoxysilane is added to absolute ethanol, and the volume ratio of the amount of 3-(2,3 glycidoxy) propyltriethoxysilane to absolute ethanol is 1mol:700mL; (2) Then add distilled water to the solution obtained in the previous step, react at a temperature of 70°C for 9 hours, and finally use a rotary evaporator to remove the solvent to obtain an epoxy silicone oligomer, distilled water and methylphenyldimethoxy The molar ratio of silane is 1:1;

[0045] Then the mass fraction of 50% epoxy silicone oligomer, 45% 4,5-epoxycyclohexane-1, 2-dicarboxylic acid diglycidyl ester, 3...

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Abstract

The invention discloses an oligomeric organosilicon anti-ultraviolet epoxy resin LED packaging adhesive. The packaging adhesive comprises a component A and a component B. The component A comprises an epoxy organosilicon oligomer, an alicyclic epoxy resin, a reactive diluent, a cross-linking agent, a transparent blue-violet dye color paste and a defoaming agent, and the component B comprises a mixed anhydride curing agent, an accelerant, an ultraviolet absorbent, polyol and an antioxidant. A preparation method of the epoxy organosilicon oligomer in the component A comprises the following steps: firstly, adding weighed epoxy group-containing silane monomer and dialkoxy silane into an organic solvent, then adding distilled water, reacting for 6-12 hours at the temperature of 40-80 DEG C, and finally, removing the solvent by using a rotary evaporator to obtain the epoxy organosilicon oligomer. The LED packaging adhesive provided by the invention is good in ultraviolet resistance, has relatively good light transmittance and mechanical properties, also gives consideration to the environmental protection problem, and is free of pungent smell.

Description

technical field [0001] The invention belongs to the field of epoxy resin LED encapsulation glue, and in particular relates to an oligomeric organic silicon anti-ultraviolet epoxy resin LED encapsulation glue. Background technique [0002] With its inherent characteristics, such as power saving, long life, shock resistance, fast response, and cold light source, LED is widely used in indicator lights, signal lights, display screens, landscape lighting and other fields, and is expected to replace traditional light sources and become a new generation Solid cold light source. [0003] Epoxy resin packaging glue is the most commonly used packaging material in the LED industry. It refers to a type of epoxy resin liquid packaging material made of epoxy resin as the main material, adding various functional additives, and a suitable curing agent. Epoxy resin has unique advantages such as strong adhesion, aging resistance, corrosion resistance, low price, and good mechanical propertie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J163/00
CPCC09J183/04C08L2203/206C08L2201/08C08L63/00
Inventor 王西翔邹军石明明
Owner SHANGHAI INST OF TECH
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