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Manufacturing method of low-cost island structure LTCC substrate

A manufacturing method and low-cost technology are applied in the manufacturing field of low-cost island structure LTCC substrates, which can solve the problems of high limit cost of green ceramic tapes, low strength of green ceramic tapes, waste of green ceramic structures, etc., and achieve dimensional stability and cost. Low, high processing efficiency

Inactive Publication Date: 2021-08-20
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the actual test process, it was found that the above-mentioned method uses the cavity green ceramic belt to limit the position of the boss part. If the thickness of the boss part is small (especially when <0.3mm), the strength of this part of the green ceramic belt is small, and it is easy to operate. Deformation, resulting in insufficient limit accuracy; if the thickness of the boss part is large, the cost of using green ceramic belt limit is high, especially for mass-produced products, most of the green ceramic structure is wasted as a one-time limit plate
In practical application, this method has great limitations

Method used

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  • Manufacturing method of low-cost island structure LTCC substrate
  • Manufacturing method of low-cost island structure LTCC substrate
  • Manufacturing method of low-cost island structure LTCC substrate

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0033] A method for manufacturing a low-cost island structure LTCC substrate, comprising the following steps:

[0034] (1) According to the product design structure, the product is typesetting and designed according to the island structure and the base structure;

[0035] (2) Cutting, aging, punching, filling and printing operations layer by layer according to the product layer design requirements;

[0036] (3) Carry out the first lamination and hot pressing of the island structure and the base structure respectively to obtain the corresponding green body;

[0037] (4) Cut the hot-pressed island green body into individual small units by means of laser or eager cutting;

[0038] (5) Process a PET film with a cavity inside by laser or mechanical punching machine, and the position corresponding to the cavity is an island structure;

[0039] (6)...

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Abstract

The invention discloses a manufacturing method of a low-cost island structure LTCC substrate, and belongs to the field of advanced manufacturing. The method mainly comprises the steps of typesetting designing, punching, printing, primary overlying, island cutting, secondary overlying, sintering and the like. According to the invention, the split type layout design is firstly adopted, and then the splicing of the island and the base is carried out through the stainless steel limiting plate so that the processing and manufacturing of the low-cost island structure LTCC substrate are realized. According to the method, the processing precision and the production efficiency of the LTCC substrate with the island structure can be improved, the utilization efficiency of the LTCC green tape is improved, the cost is reduced, and the method has a better application prospect especially for batch production tasks.

Description

technical field [0001] The invention belongs to the field of advanced manufacturing technology, in particular to a manufacturing method of a low-cost island structure LTCC substrate. [0002] technical background [0003] Low temperature co-fired ceramic (LTCC) technology is a passive component integrated circuit technology developed in the 1980s. Multi-layer LTCC substrate technology can integrate some passive components into the substrate, making it have the advantages of high speed, high frequency, high density, high reliability, etc., which is conducive to system miniaturization, and improves system reliability while increasing circuit assembly density , so it is widely used in microwave communication, aerospace and military electronics and other fields. [0004] In order to meet the requirements of different product structures and packaging forms, LTCC substrates have different shapes and structures. The usual structural forms include standard squares and heterogeneous ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0026H05K3/0047H05K3/0052
Inventor 卢会湘赵飞唐小平严英占王康李攀峰刘秀婷
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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