Flip chip packaging unit and packaging method

Abstract

The invention provides a flip chip packaging unit and a packaging method for manufacturing the flip chip packaging unit. The flip chip packaging unit may include an integrated circuit wafer, a winding substrate, an underfill material and a heat conduction protection layer, wherein the integrated circuit waferhas a wafer first surface on which a plurality of metal posts are fabricated and a wafer second surface opposite to the wafer first surface; the winding substrate is provided with a substrate first surface and a substrate second surface opposite to the substrate first surface, and the wafer first surface of the integrated circuit wafer faces the substrate second surface and is welded on the winding substrate; the underfill material fills a gap between the wafer first surface of the integrated circuit wafer and the substrate second surface; and the heat conduction protection layer at least wraps, covers and is in direct contact with a part of the wafer second surface and the wafer side surface of the integrated circuit wafer, so that the heat dissipation performance of the integrated circuit wafer can be improved, and meanwhile, the heat conduction protection layer can play a better role in protecting the integrated circuit wafer.

Description

technical field [0001] Embodiments of the present disclosure relate to integrated circuits, and in particular, to packaging structures and packaging methods for flip chips. Background technique [0002] Flip-chip packaging of chips with integrated circuits is a type of integrated circuit packaging. For integrated circuit chips that need to handle higher power, heat dissipation performance is a design index that needs to be considered. At present, when the integrated circuit chip is flip-chip packaged, it is used to wrap the chip with plastic packaging material and then remove the plastic packaging material on the back of the chip to expose the back of the chip to improve the heat dissipation effect. However, the back of the chip is exposed during storage or transportation. Increased risk of damage. Contents of the invention [0003] In one aspect, the present disclosure provides a flip-chip packaging unit, which may include: an integrated circuit wafer having a first sur...

AI Technical Summary

Problems solved by technology

At present, when the integrated circuit chip is flip-chip packaged, the chip is wrapped with a plastic packaging material and then the plastic packaging material on the back of the chip is removed to expose the back of the chip to improve the heat dissipation effect. However, the back of the chip is exposed during storage or transportation. increased risk of damage

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