Miniaturized ultra-wideband metamaterial wave absorber structure for inhibiting electromagnetic radiation and application of miniaturized ultra-wideband metamaterial wave absorber structure

Abstract

The invention discloses a miniaturized ultra-wideband metamaterial wave absorber structure for inhibiting electromagnetic radiation and application. The designed metamaterial wave absorber unit is mainly composed of a loss layer, a lossy dielectric layer and a metal backboard. The loss layer and the metal backboard are located on the upper surface and the lower surface of the lossy dielectric layer respectively. The loss layer comprises an inner ring metal sheet, a middle ring metal sheet and an outer ring metal sheet which are concentrically and sequentially arranged from inside to outside; openings are formed in the two opposite angles of each annular metal sheet, the sizes of the openings are the same, and the opening directions are the same diagonal direction. The metamaterial wave absorber unit is small in structural size, has the characteristics of stable angle and polarization insensitivity, has high radiation absorption capacity in a broadband range, can obviously reduce electromagnetic interference radiation under the condition that the performance of an original packaging chip is not influenced, and is simple in structure and easy to process.

Description

technical field [0001] The present invention relates to a metamaterial absorbing structure in the technical field of chip packaging and electromagnetic interference suppression of printed circuit boards, in particular to a miniaturized ultra-broadband metamaterial absorber, which is applied to packaging products or on-chip chips and off-chip radiation suppression of the device. Background technique [0002] With the birth and development of 5G communication technology, digital systems such as multilayer printed circuit boards and integrated circuit packaging are developing towards high integration, miniaturization, and high-speed and high-frequency development, resulting in more electromagnetic interference problems. Since the package cover and heat sink are generally very close to the chip surface, part of the noise will be coupled to the package cover and heat sink through the electric field, and at the same time, a resonant cavity will be formed between the two and the po...

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Problems solved by technology

[0003] Generally, grounding is used to solve the problem of electromagnetic radiation caused by the package cover and heat sink, but this method is only effective at low frequencies, and has no obvious inhibitory effect on high-frequency electromagnetic radiation, and may even worsen the electromagnetic radiation at high frequencies

Radiation suppression methods for high-speed digital systems also include using magnetic thin film materials, coating them on the surface of signal traces, or placing them around the packaging substrate to absorb high-frequency noise, but the absorbing performance of magnetic materials will be affected by temperature. As the electromagnetic frequency increases, its absorbing or shielding performance will decrease

The application of the electromagnetic bandgap metamaterial structure in the suppression of electromagnetic interference in high-speed digital systems has also received high attention. It is a breakthrough technology that may achieve wide-band, high-isolation noise suppression. This technology can retain the structural integrity of power and ground planes. However, the size of the electromagnetic bandgap structure is large, and the miniaturization of the structural unit will also make processing and modeling very difficult.

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