Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for thinning FeNi alloy foil tape through chemical etching

A technology of chemical etching and alloy foil, which is applied in the field of non-ferrous metal foil processing, and can solve problems such as affecting etching processing, forming streaks on the surface of thin plates, and easy deformation

Active Publication Date: 2021-09-14
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the current precision rolling process, it is the limit to obtain a thin plate with a thickness of 20-30 μm, and the rolling process is easy to form defects such as streaks on the surface of the thin plate, and internal stress is generated inside the strip, and it is easy to deform during further material reduction. Affect the subsequent etching process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for thinning FeNi alloy foil tape through chemical etching
  • Method for thinning FeNi alloy foil tape through chemical etching
  • Method for thinning FeNi alloy foil tape through chemical etching

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1 A method of chemically etching thinned FeNi alloy foil strips provided in this embodiment includes:

[0033] The FeNi alloy sheet with a thickness of 100 μm is alkaline washed for 5 minutes with KOH aqueous solution with a concentration of about 0.5mol / L, and then dried with hot air at about 40°C;

[0034] Spray the FeNi alloy thin plate evenly with an etching solution at a temperature of 30°C. The etching solution contains a HCl concentration of 10mol / L and a FeCl concentration of 30g / L. 3 and the rest of the water, the spray pressure is 0.2MPa, and the spray time is 20 minutes;

[0035] The obtained FeNi alloy foil strip was taken out, sprayed and cleaned with NaOH aqueous solution with a concentration of 0.5mol / L, and then dried in a drying oven at 40°C. The thickness of the obtained FeNi alloy foil strip was 50 μm, and its etched surface morphology was as follows: figure 1 shown, and its surface stress value does not exceed ±5MPa.

Embodiment 2

[0037] Embodiment 2 A method of chemically etching thinned FeNi alloy foil strips provided in this embodiment includes:

[0038] The FeNi alloy sheet with a thickness of 50 μm is alkaline washed for 5 minutes with KOH aqueous solution with a concentration of 0.6mol / L, and dried with hot air at about 50°C;

[0039] Spray the FeNi alloy thin plate evenly with an etching solution at a temperature of 30°C. The etching solution contains a HCl concentration of 10mol / L and a FeCl concentration of 30g / L. 3 and the rest of the water, the spray pressure is 0.2MPa, and the spray time is 10 minutes;

[0040] The obtained FeNi alloy foil strip was taken out, sprayed and cleaned with NaOH aqueous solution with a concentration of 0.5mol / L, and then dried in a drying oven at 60°C. The thickness of the obtained FeNi alloy foil strip was 25 μm, and its etched surface morphology was as follows: figure 2 shown.

Embodiment 3

[0041] Embodiment 3 A method of chemically etching thinned FeNi alloy foil strips provided in this embodiment includes:

[0042] The FeNi alloy sheet with a thickness of 40 μm is alkaline washed for 3 minutes with KOH aqueous solution with a concentration of 0.5mol / L, and dried with hot air at about 60°C;

[0043] Spray the FeNi alloy thin plate evenly with an etching solution at a temperature of 30°C. The etching solution contains a HCl concentration of 10mol / L and a FeCl concentration of 15g / L. 3 And the remaining water, the spray pressure is 0.1MPa, and the spray time is 10 minutes;

[0044]The obtained FeNi alloy foil strip was taken out, sprayed and cleaned with NaOH aqueous solution with a concentration of 0.5mol / L, and then dried in a drying oven at 50°C. The thickness of the obtained FeNi alloy foil strip was 20 μm, and its etched surface morphology was as follows: image 3 shown.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
surface roughnessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for thinning a FeNi alloy foil tape through chemical etching. The method comprises the following steps of: pretreating a FeNi alloy thin plate, uniformly spraying an etching solution on the FeNi alloy thin plate to etch and thin the FeNi alloy thin plate to form an FeNi alloy foil tape, and post-treating the FeNi alloy foil tape, wherein the etching solution is prepared from FeCl3, HCl and water. The method is simple and easy to operate, the thickness of the FeNi alloy thin plate can be further rapidly and uniformly reduced, a rolled hardened layer on the surface of the FeNi alloy thin plate can be further removed, and the internal plastic strain and residual stress of the FeNi alloy thin plate can be reduced, so that deformation during etching and material reduction is inhibited, the flexibility of the FeNi alloy foil tape is effectively improved, the yield of mask manufacturing is remarkably improved, and post-treatment does not need. The method is suitable for FeNi alloy thin plates with various components, sizes and thicknesses, and the obtained FeNi alloy foil strip is uniform in thickness and low in surface roughness.

Description

technical field [0001] The invention relates to a method for thinning FeNi alloy foil strips, in particular to a method for chemically etching thin FeNi alloy foil strips, and belongs to the field of nonferrous metal foil material processing. Background technique [0002] FeNi alloy foil is currently the preferred material for preparing masks for OLED evaporation due to its good processability and extremely low thermal expansion coefficient. With the improvement of OLED resolution, the hole size and spacing on the mask are required to be smaller, so the thickness of the mask material is required to be smaller, and the minimum thickness currently desired is 15 μm. However, with the current precision rolling process, it is the limit to obtain a thin plate with a thickness of 20-30 μm, and the rolling process is easy to form defects such as streaks on the surface of the thin plate, and internal stress is generated inside the strip, and it is easy to deform when the material is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/28C23G1/19
CPCC23F1/28C23G1/19
Inventor 张青科宋振纶杨丽景胡方勤姜建军郑必长
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com