Self-cooling chip and temperature measuring device and method thereof

Abstract

The invention discloses a self-cooling chip and a temperature measuring device and method thereof. The microstructure of the chip is designed based on the fractal theory, so that the self-heat-dissipation efficiency of the chip is improved while an additional heat dissipation device is not added. A holographic interference technology is applied, a chip temperature measuring device comprising a laser, an optical lens, a CCD camera, a computer and a transmission mechanism is established, the temperature of a chip is measured, and the temperature of the chip is accurately measured in real time. A servo motor is used for driving a transmission mechanism to drive a wedge-shaped plate to turn over, so that the position of a laser beam emitted by a measuring laser on a chip is changed, interference fringes on the surface of the chip are collected through a CCD camera and then transmitted to a computer to be processed, and the distribution condition of the surface temperature of the chip is obtained.

Description

Technical field [0001] The present invention belongs to the field of chip heat dissipation technology, and a method of cooling the chip in a MEMS system and an apparatus for real-time measurement of the chip temperature, and is specifically referred to as a self-refining chip and a temperature measuring device and method thereof. Background technique [0002] The board chip is the main form of MEMS processing, the chip and electronic components produce a certain amount of heat during normal operation. If it is not dispersed in time, the chip junction temperature increases, and even causing the device or system failure. As the microelectronic package is reduced, the power increases, the volume of the chip unit has increased dramatically. If the temperature is too high, it can be invalid, such as thermal shot, rationure, metallization failure, etc. The temperature is high. Further, the thermal expansion coefficient of the internal silicon chip, encapsulating, substrate, and other s...

AI Technical Summary

Problems solved by technology

As the volume of microelectronic packaging decreases and the power increases, the calorific value per unit volume of the chip increases sharply. If the temperature is too high, it is easy to induce failure, such as: thermal breakdown, junction failure, metallization failure, etc.; if the temperature is too high, the performance will decrease

In addition, under the continuous thermal load conditions generated by the chip, MEMS devices are prone to mismatching of the thermal expansion coefficients of the internal silicon chip, packaging glue, substrate and other structures, resulting in interlayer thermal stress and thermal deformation in the chip structure due to thermal mismatch. The peeling stress and shear stress between the structural interfaces will lead to delamination and warping of the packaging structure, and in severe cases, the entire MEMS device will fail

However, conventional air cooling, liquid cooling, and phase change cooling methods need to add fans, circulation systems, heat pipes and other devices, which are not suitable for MEMS systems below the millimeter or even micron scale

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