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Anti-vulcanization high-brightness LED packaging substrate and packaging structure

A technology of LED packaging and packaging structure, which is applied in the direction of air-proof/waterproof devices, lighting devices, lighting device components, etc., and can solve problems such as reducing the service life of LEDs, affecting LED luminous brightness, and insufficient anti-sulfurization of LED packaging substrates. To achieve the effect of improving the packaging effect

Inactive Publication Date: 2021-09-17
SHENZHEN HUATIAN MAIKE OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Nowadays, with the development of LED technology and the wide application of lighting and backlight fields, the market demand for LEDs is also more extensive. At present, the traditional LED packaging substrate process is usually packaged and sealed through packaging glue, but this There are still deficiencies in the packaging method. If the external sulfur element penetrates into the silver plated layer of the bracket through the junction of the plastic material of the bracket and the copper material, the silver in the silver-plated layer of the bracket undergoes a chemical reaction, and then produces black silver sulfide, which affects the brightness of the LED. It also reduces the service life of the LED, so there are still deficiencies in the anti-sulfurization of the LED packaging substrate, so it cannot meet the needs of users. Therefore, it is necessary to further improve

Method used

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  • Anti-vulcanization high-brightness LED packaging substrate and packaging structure
  • Anti-vulcanization high-brightness LED packaging substrate and packaging structure
  • Anti-vulcanization high-brightness LED packaging substrate and packaging structure

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Experimental program
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Embodiment 1

[0030] see figure 2 and Figure 4 and Figure 5 , an anti-vulcanization high-brightness LED packaging substrate and packaging structure, including a main body 1, an packaging auxiliary assembly 8 and an evacuation assembly 9 are installed on the inner wall of the main body 1, and the evacuation assembly 9 is arranged at the bottom of the inner wall of the main body 1, and the packaging auxiliary assembly The assembly 8 includes packaging components 81, and packaging sealing bags 82 are installed between the packaging components 81. The packaging auxiliary assembly 8 includes a mounting frame 91, and an evacuation fan 92 is installed in the mounting frame 91, and the upper side of the mounting frame 91 is fixedly installed. Pipe 93, the bottom of the fixed pipe 93 is connected with the evacuation fan 92, the top of the fixed pipe 93 is fixedly equipped with an evacuated gun head 94, and the upper side of the evacuated gun head 94 is connected with the bottom of the sealing ba...

Embodiment 2

[0037] see Figure 1 to Figure 7 , an anti-vulcanization high-brightness LED packaging substrate and packaging structure, including a main body 1, an packaging auxiliary assembly 8 and an evacuation assembly 9 are installed on the inner wall of the main body 1, and the evacuation assembly 9 is arranged at the bottom of the inner wall of the main body 1, and the packaging auxiliary assembly The assembly 8 includes packaging components 81, and packaging sealing bags 82 are installed between the packaging components 81. The evacuation assembly 9 includes a mounting frame 91. An evacuation fan 92 is installed in the mounting frame 91, and a fixed tube is fixedly installed on the upper side of the mounting frame 91. 93, the bottom of the fixed pipe 93 is matched with the evacuation fan 92, the top of the fixed pipe 93 is fixedly equipped with an evacuated gun head 94, and the upper side of the evacuated gun head 94 is matched with the bottom of the sealing bag 82.

[0038] Further,...

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Abstract

The invention provides an anti-vulcanization high-brightness LED packaging substrate and packaging structure, the anti-vulcanization high-brightness LED packaging substrate comprises a main body, the inner wall of the main body is provided with a packaging auxiliary assembly and an evacuation assembly, the evacuation assembly is arranged at the bottom of the inner wall of the main body, the packaging auxiliary assembly comprises packaging parts, and a packaging sealing bag is arranged between the packaging parts. The evacuation assembly comprises an installation frame, an evacuation fan is installed in the installation frame, a fixing pipe is fixedly installed on the upper side of the installation frame, and the bottom of the fixing pipe is connected with the evacuation fan in a matched mode. According to the anti-vulcanization high-brightness LED packaging substrate and the packaging structure, the packaging sealing bag is used for vacuum packaging, so that a layer of film-shaped product is always kept, the base of an LED lamp is protected, and the situation that external air enters the LED lamp to chemically react with silver in a silver coating inside the LED lamp is effectively avoided, therefore, the anti-vulcanization capability and quality of the LED lamp are improved, and the service life of the LED lamp is prolonged.

Description

technical field [0001] The invention belongs to the technical field of LED packaging substrate machinery, and in particular relates to an anti-sulfurization high-brightness LED packaging substrate and a packaging structure. Background technique [0002] Light-emitting diodes, referred to as LEDs for short, are made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc. When electrons and holes recombine, they can radiate visible light, so they can be used to make Light-emitting diodes are used as indicator lights in circuits and instruments, or to form text or digital displays. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. Due to chemical properties, it is divided into organic light-emitting diode OLED and inorganic light-emitting diode LED. [0003] Nowadays, with the development of LED technology and the wide applicatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/235F21V15/00F21V15/04F21V31/00F21Y115/10
CPCF21K9/235F21V15/00F21V15/04F21V31/005F21Y2115/10
Inventor 陈苏南
Owner SHENZHEN HUATIAN MAIKE OPTOELECTRONICS TECH CO LTD