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Transparent polyimide conductive film

A transparent polyimide, polyimide-based film technology, applied in the field of conductive films, can solve the problems of reduced transparency and conductivity of conductive films, prone to agglomeration, affecting conductivity, etc., to improve adhesion performance, The effect of improving wetting performance and improving adhesion

Active Publication Date: 2021-10-19
浙江中科玖源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the adhesion between the silver nanowires and the base film is poor, and it is easy to fall off, which affects the conductivity; and the silver nanowires are prone to agglomeration during the drying process, which will reduce the transparency and conductivity of the conductive film.

Method used

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  • Transparent polyimide conductive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A transparent polyimide conductive film, comprising: a transparent polyimide base film and a conductive layer attached to the surface of the polyimide base film;

[0022] Among them, in the preparation process of the transparent polyimide base film, 0.1137g of octaaminopropyl cage silsesquioxane was added to 60ml of N-methylpyrrolidone, and after ultrasonic dispersion for 30 minutes, 0.0297mol of 2,2'-bis (Trifluoromethyl)-4,4'-diaminobiphenyl was mixed evenly, and nitrogen gas was introduced, and then 1,2,4,5-cyclohexanetetracarboxylic dianhydride (0.03mol in total) was added in 3 times, Reaction at 50°C for 8 hours, degassing to obtain a polyamic acid solution; apply the polyamic acid solution on the surface of the substrate, keep it at 110°C, 160°C, 220°C, 270°C, and 300°C for 0.5h, cool to room temperature to obtain a transparent Polyimide base film;

[0023] The above-mentioned conductive layer is obtained by coating the surface of polyimide base film with conduct...

Embodiment 2

[0025] A transparent polyimide conductive film, comprising: a transparent polyimide base film and a conductive layer attached to the surface of the polyimide base film;

[0026] Among them, in the preparation process of the transparent polyimide base film, 0.0814g of octaaminopropyl cage silsesquioxane was added to 60ml of N-methylpyrrolidone, and after ultrasonic dispersion for 30min, 0.02985mol of 2,2'-bis (Trifluoromethyl)-4,4'-diaminobiphenyl was mixed evenly, and nitrogen gas was introduced, and then 1,2,4,5-cyclohexanetetracarboxylic dianhydride (0.03mol in total) was added in 3 times, Reaction at 50°C for 8 hours, degassing to obtain a polyamic acid solution; apply the polyamic acid solution on the surface of the substrate, keep it at 110°C, 160°C, 220°C, 270°C, and 300°C for 0.5h, cool to room temperature to obtain a transparent Polyimide base film;

[0027] The above-mentioned conductive layer is obtained by coating the surface of polyimide base film with conductive ...

Embodiment 3

[0029] A transparent polyimide conductive film, comprising: a transparent polyimide base film and a conductive layer attached to the surface of the polyimide base film;

[0030] Among them, in the preparation process of the transparent polyimide base film, 0.0976g of octaaminopropyl cage silsesquioxane was added to 60ml of N-methylpyrrolidone, and after ultrasonic dispersion for 30min, 0.02978mol2,2'-bis (Trifluoromethyl)-4,4'-diaminobiphenyl was mixed evenly, and nitrogen gas was introduced, and then 1,2,4,5-cyclohexanetetracarboxylic dianhydride (0.03mol in total) was added in 3 times, Reaction at 50°C for 8 hours, degassing to obtain a polyamic acid solution; apply the polyamic acid solution on the surface of the substrate, keep it at 110°C, 160°C, 220°C, 270°C, and 300°C for 0.5h, cool to room temperature to obtain a transparent Polyimide base film;

[0031] The above-mentioned conductive layer is obtained by coating the surface of polyimide base film with conductive ink,...

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Abstract

The invention discloses a transparent polyimide conductive film which comprises a transparent polyimide base film and a conductive layer attached to the surface of the transparent polyimide base film. The transparent polyimide base film is obtained by carrying out in-situ polymerization and imidization on octa-aminopropyl polyhedral oligomeric silsesquioxane, a diamine monomer and a dianhydride monomer. The adhesive force is good, the silver nanowires are not prone to falling off, and transparency is good.

Description

technical field [0001] The invention relates to the technical field of conductive films, in particular to a transparent polyimide conductive film. Background technique [0002] With the gradual expansion of the application market of flexible electronic devices, such as silicon-based solar cells, flat panel displays, light-emitting diodes, and wearable electronic devices, etc. Indium tin oxide (Indium Tin Oxide, ITO) has been the main material of the transparent conductive film because of its high light transmittance and electrical conductivity. However, the inherent brittleness of ITO makes it unsuitable for application on flexible substrates. In addition, metal indium is expensive, more toxic than lead, and has low reserves on the earth. It is necessary to develop a new material with performance similar to or even better than ITO. Nano-silver wire has good conductivity and light transmittance, and can replace ITO. However, the adhesion between the silver nanowires and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/044C08J5/18C08G73/10C08L79/08
CPCC08J7/044C08J7/0427C08J5/18C08G73/1078C08G73/1007C08J2379/08C08J2463/00Y02E10/549
Inventor 解惠东徐哲邵成蒙
Owner 浙江中科玖源新材料有限公司