Transparent polyimide conductive film
A transparent polyimide, polyimide-based film technology, applied in the field of conductive films, can solve the problems of reduced transparency and conductivity of conductive films, prone to agglomeration, affecting conductivity, etc., to improve adhesion performance, The effect of improving wetting performance and improving adhesion
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Embodiment 1
[0021] A transparent polyimide conductive film, comprising: a transparent polyimide base film and a conductive layer attached to the surface of the polyimide base film;
[0022] Among them, in the preparation process of the transparent polyimide base film, 0.1137g of octaaminopropyl cage silsesquioxane was added to 60ml of N-methylpyrrolidone, and after ultrasonic dispersion for 30 minutes, 0.0297mol of 2,2'-bis (Trifluoromethyl)-4,4'-diaminobiphenyl was mixed evenly, and nitrogen gas was introduced, and then 1,2,4,5-cyclohexanetetracarboxylic dianhydride (0.03mol in total) was added in 3 times, Reaction at 50°C for 8 hours, degassing to obtain a polyamic acid solution; apply the polyamic acid solution on the surface of the substrate, keep it at 110°C, 160°C, 220°C, 270°C, and 300°C for 0.5h, cool to room temperature to obtain a transparent Polyimide base film;
[0023] The above-mentioned conductive layer is obtained by coating the surface of polyimide base film with conduct...
Embodiment 2
[0025] A transparent polyimide conductive film, comprising: a transparent polyimide base film and a conductive layer attached to the surface of the polyimide base film;
[0026] Among them, in the preparation process of the transparent polyimide base film, 0.0814g of octaaminopropyl cage silsesquioxane was added to 60ml of N-methylpyrrolidone, and after ultrasonic dispersion for 30min, 0.02985mol of 2,2'-bis (Trifluoromethyl)-4,4'-diaminobiphenyl was mixed evenly, and nitrogen gas was introduced, and then 1,2,4,5-cyclohexanetetracarboxylic dianhydride (0.03mol in total) was added in 3 times, Reaction at 50°C for 8 hours, degassing to obtain a polyamic acid solution; apply the polyamic acid solution on the surface of the substrate, keep it at 110°C, 160°C, 220°C, 270°C, and 300°C for 0.5h, cool to room temperature to obtain a transparent Polyimide base film;
[0027] The above-mentioned conductive layer is obtained by coating the surface of polyimide base film with conductive ...
Embodiment 3
[0029] A transparent polyimide conductive film, comprising: a transparent polyimide base film and a conductive layer attached to the surface of the polyimide base film;
[0030] Among them, in the preparation process of the transparent polyimide base film, 0.0976g of octaaminopropyl cage silsesquioxane was added to 60ml of N-methylpyrrolidone, and after ultrasonic dispersion for 30min, 0.02978mol2,2'-bis (Trifluoromethyl)-4,4'-diaminobiphenyl was mixed evenly, and nitrogen gas was introduced, and then 1,2,4,5-cyclohexanetetracarboxylic dianhydride (0.03mol in total) was added in 3 times, Reaction at 50°C for 8 hours, degassing to obtain a polyamic acid solution; apply the polyamic acid solution on the surface of the substrate, keep it at 110°C, 160°C, 220°C, 270°C, and 300°C for 0.5h, cool to room temperature to obtain a transparent Polyimide base film;
[0031] The above-mentioned conductive layer is obtained by coating the surface of polyimide base film with conductive ink,...
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