Unlock instant, AI-driven research and patent intelligence for your innovation.

Novel compound, polymer and method for producing same, photosensitive resin composition, pattern forming method, cured film, and electronic component

A compound and resin technology, applied in the fields of new compounds, polymers and their preparation, photosensitive resin compositions, pattern formation, cured films, and electronic components, can solve problems such as poor heat resistance and poor mechanical strength, and achieve high resolution Excellent, excellent solvent solubility, effect of improving tensile strength and elongation

Pending Publication Date: 2021-10-22
SHIN ETSU CHEM CO LTD +1
View PDF12 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This structural unit has an alicyclic structure with a lower aromatic density than the above-mentioned fluorene structure and excellent solubility, so higher solvent solubility can be expected, but it is known that its heat resistance and mechanical strength are lower than those of poly Imide resin poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel compound, polymer and method for producing same, photosensitive resin composition, pattern forming method, cured film, and electronic component
  • Novel compound, polymer and method for producing same, photosensitive resin composition, pattern forming method, cured film, and electronic component
  • Novel compound, polymer and method for producing same, photosensitive resin composition, pattern forming method, cured film, and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0357] Hereinafter, the present invention will be specifically described by showing synthesis examples, comparative synthesis examples, working examples, and comparative examples, but the present invention is not limited to the following examples.

[0358] The chemical structural formulas of the compounds used in the following synthesis examples are shown below.

[0359]

Synthetic example 1 2

[0360] [Synthesis example 1] dicarboxylic acid (X CA -1) Synthesis

[0361] Under the condition of 70°C, add 25g (143mmol) of methyl 4-(cyanomethyl)benzoate, 77g (357mmol) of 1,4-dibromobutane, 0.8g (3.6mmol) of benzyltriethylammonium chloride mmol) was added dropwise to 114 g (1.43 mol) of a 50% aqueous sodium hydroxide solution, followed by reaction for 6 hours. The reaction liquid was cooled to room temperature, and after removing the liquid portion in the flask, the remaining colloidal precipitate was washed several times with toluene. 200 mL of 50% sulfuric acid aqueous solution was added under ice-cooling, and the reaction was carried out under reflux for 1 week. After the precipitated solid was filtered, washed with isopropyl ether, and dried under reduced pressure, the dicarboxylic acid (X CA -1) 17g.

Synthetic example 2 2

[0362] [Synthesis example 2] dicarboxylic acid (X CA -2) Synthesis

[0363] 1,4-dibromobutane in synthesis example 1 is replaced by 1,5-dibromopentane 82g, except that, obtain dicarboxylic acid (X CA -2) 10g.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
wavelengthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention addresses the problem of providing: a compound capable of deriving a polyimide which can be used as a polyimide having excellent characteristics such as solubility without impairing mechanical strength; a polyimide resin obtained using the compound; and a method for producing the polyimide resin. The base resin can form a fine pattern and can obtain a photosensitive resin composition with high resolution. The compound is characterized by being represented by general formula (1).

Description

technical field [0001] The present invention relates to a compound useful as a structural unit of a polyimide resin, a polyimide resin obtained by using the compound, a method for producing the same, and a positive-type photosensitive compound using the polyimide resin as a base resin. A resin composition or a negative photosensitive resin composition, a pattern forming method capable of development with an alkaline aqueous solution using the composition, and a cured film forming method. In addition, it relates to an interlayer insulating film, a surface protection film, and an electronic component using the cured film. Background technique [0002] Along with the miniaturization and high performance of various electronic devices such as personal computers, digital cameras, and mobile phones, the demand for further miniaturization, thinning, and high density of semiconductor elements is also rapidly increasing. Therefore, it is desired to develop a method that can cope with...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C07C69/76C07C69/78C07C219/34C08G73/10C08G73/14G03F7/038G03F7/039G03G7/00
CPCC07C219/34C07C69/78C07C69/76C08G73/14G03G7/004G03F7/0387G03F7/039C08G73/1075C08G73/1039C07C2601/08C08G73/24G03F7/0233G03F7/0226G03F7/038G03F7/0382G03F7/40C07C63/49C07C233/64C07C211/53C08G73/1042G03F7/023G03F7/2004G03F7/26G03F7/168C07C2601/16C07C2601/14C07C211/49C07C233/65G03F7/022G03F7/162G03F7/20G03F7/322G03F7/38
Inventor 德米特里·祖巴列夫浦野宏之竹村胜也饭尾匡史本田和也河合义夫
Owner SHIN ETSU CHEM CO LTD