Copper-nickel-tin-silicon alloy and preparation method and application thereof

A copper-nickel-tin-silicon alloy technology, applied in the field of alloys, can solve the problems of insufficient alloy hardness, low content of tin element, and limited precipitated phases

Active Publication Date: 2021-10-29
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the low tin content of the above alloys, the precipitation phases produced during the aging treatment are limited, so the hardness of the alloys is not high enough

Method used

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  • Copper-nickel-tin-silicon alloy and preparation method and application thereof
  • Copper-nickel-tin-silicon alloy and preparation method and application thereof
  • Copper-nickel-tin-silicon alloy and preparation method and application thereof

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preparation example Construction

[0038] The present invention provides a method for preparing the copper-nickel-tin-silicon alloy described in the above technical solution, comprising the following steps:

[0039] Melting alloy raw materials to obtain alloy liquid, and pouring the alloy liquid to obtain cast alloy;

[0040] performing hot rolling and solution treatment on the as-cast alloy in sequence to obtain a solid solution alloy; the temperature of the solution treatment is 725-875°C;

[0041] The solid solution alloy is subjected to cold rolling and aging treatment in sequence to obtain a copper-nickel-tin-silicon alloy; the temperature of the aging treatment is 250-450° C.

[0042] In the present invention, unless otherwise specified, all raw material components are commercially available products well known to those skilled in the art.

[0043] In the invention, alloy raw materials are smelted to obtain alloy liquid, and the alloy liquid is poured to obtain cast alloy.

[0044] In the present invent...

Embodiment 1

[0055] The chemical composition design of the copper-nickel-tin-silicon alloy is carried out using Pandat software, open the Pandat software, select Cu, Ni, Sn, Si four elements, set the Ni mass percentage content as 6%, the Sn mass percentage content as 6%, Si is a variable, and the balance is Cu; set the calculation temperature to 300-1200°C; calculate the phase diagram and output the results, the simulated phase diagram results of Cu-6Ni-6Sn-xSi alloy are as follows figure 1 , where FCC stands for face-centered cubic structure and L stands for liquid phase. Depend on figure 1 It can be seen that when the Si content exceeds 0.15wt%, the alloy will produce γ-Ni during solidification 5 Si 2 phase, and exists with the FCC matrix and L, which can theoretically explain the γ-Ni 5 Si 2 It is the primary phase, and it can be predicted that it cannot be eliminated by solution treatment.

[0056] according to figure 1 It is determined that the alloy composition is 6wt% Ni, 6wt%...

Embodiment 2～5

[0064] The copper-nickel-tin-silicon alloy was prepared according to the method of Example 1, and the preparation conditions of Examples 2-5 are shown in Table 1.

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Abstract

The invention provides a copper-nickel-tin-silicon alloy and a preparation method thereof, and belongs to the technical field of alloys. The copper-nickel-tin-silicon alloy comprises the chemical composition of 6wt% of Ni, 6wt% of Sn, 0.15-1wt% of Si and the balance of copper, and the phase composition of the copper-nickel-tin-silicon alloy comprises a copper matrix, a gamma-Ni5Si2 primary phase, a DO22 type precipitated phase and an L12 type precipitated phase. According to the copper-nickel-tin-silicon alloy, 0.15-1wt% of Si is added into the Cu-6Ni-6Sn alloy, and gamma-Ni5Si2 primary phase can be introduced into the structure as a nucleation particle in the alloy solidification process so as to achieve the purpose of refining crystal grains or dendritic crystals, so that the serious segregation phenomenon of the alloy in the solidification structure is improved; and meanwhile, a primary phase still exists in the alloy after solution treatment, generation of a discontinuous precipitation gamma phase in the aging treatment process of the alloy can be effectively inhibited, abnormal growth of crystal grains in the aging treatment process can be avoided, and therefore the mechanical property and the wear resistance of the copper-nickel-tin-silicon alloy are improved.

Description

technical field [0001] The invention relates to the technical field of alloys, in particular to a copper-nickel-tin-silicon alloy and a preparation method and application thereof. Background technique [0002] Copper-nickel-tin alloy is a relatively new type of copper alloy, which has the advantages of high strength, high elasticity, wear resistance and corrosion resistance, and has broad application prospects in the fields of aerospace, rail transit, heavy-duty machinery and marine engineering. However, there are two technical difficulties in the preparation of copper-nickel-tin alloys. One is the segregation of tin elements during the solidification process, resulting in a large amount of tin-rich phases; mechanical properties. The addition of alloying elements combined with a reasonable heat treatment process can solve the above two problems to a certain extent. For example, the prior art "Research on Solid Solution Treatment Process and Microstructure of Cu-9.5Ni-2.3Sn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22C9/02C22C1/02C22F1/08
CPCC22C9/06C22C9/02C22C1/02C22F1/08
Inventor 王鹏飞王玉帅梁转琴原霞张恺杨伟
Owner ZHONGBEI UNIV
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