6results about How to "Avoid remelting" patented technology

The invention provides a support-free forming method for laser powder bed melting, and relates to the technical field of metal additive manufacturing, and the horizontal support-free forming method for laser powder bed melting comprises the following steps: S1, printing a first-layer support-free overhanging surface by using an out-of-focus laser beam, so that a first-layer metal powder is in a sintering state, and a first-layer sintering layer is formed; s2, printing a predetermined number of layers of support-free overhanging surfaces layer by layer by using an out-of-focus laser beam, melting each new printing layer, remelting the previous printing layer, and avoiding remelting to the lower surface of the first sintering layer; and S3, after printing of the support-free overhanging surface with the preset number of layers is completed, subsequent layer printing is conducted. The first sintering layer is printed by using the out-of-focus laser beam, so that a supporting foundation is provided for a subsequent overhanging structure, and the problem of collapse of the first layer is avoided. Fusion and combination of each new printing layer and the previous printing layer are controlled, remelting to the lower surface of the first layer is avoided, the upper surface and the lower surface which are not supported are smooth, and powder adhesion is avoided.

The invention discloses a preparation method of a high-thermal-conductivity and high-forming 6-series anodized aluminum oxide sheet. The aluminum alloy comprises the following chemical components in percentage by mass: 0.3 to 0.5 percent of Si, 0.08 to 0.20 percent of Fe, less than 0.10 percent of Cu, less than 0.03 percent of Mn, 0.4 to 0.6 percent of Mg, 0.010 to 0.025 percent of Ti and the balance of aluminum and inevitable impurities. According to the aluminum alloy sheet with the thickness of 0.5 mm to 2.0 mm, the tensile strength is 180 MPa to 240 MPa, the yield strength is 150 MPa to 210 MPa, the ductility is larger than or equal to 12%, the work hardening index n value is larger than or equal to 0.60, the plastic strain ratio r value is larger than or equal to 0.23, the surface and transverse average grain size is 35 micrometers to 80 micrometers, and the heat conductivity is larger than 200 W / (mK).

The present application relates to the technical field of continuous casting process in steel metallurgy, in particular to a continuous casting ladle rotary table bottom argon blowing control device and a soft blowing inclusion removal method, which is provided with an argon blowing automatic butt joint mechanism and an argon blowing intelligent control switching device, realizes automatic butt joint of the continuous casting ladle rotary table ladle bottom argon blowing and automatic switching of the rotary arm argon blowing intelligent control mode, uses the existing ladle bottom blowing gas permeable brick to realize small flow static soft blowing in the pouring position of the continuous casting ladle rotary table and small flow dynamic soft blowing in the pouring process, completely replaces the existing technology LF refining later stage ladle soft blowing, overcomes the bottleneck problem of long LF refining time and the restriction of steelmaking production capacity improvement, improves the inclusion removal rate of the ladle bottom blowing gas permeable brick soft blowing, and improves the molten steel quality.

This invention relates to a novel phosphorus-fluorine curing agent for phosphogypsum and its preparation method, belonging to the technical field of industrial solid waste treatment and resource utilization. The curing agent of this invention comprises slag powder, anhydrous sodium sulfate, water glass, water, sodium hydroxide, and a Fe3O4@SiO2@Zr-Al bimetallic oxide stabilizer. The Fe3O4@SiO2@Zr-Al bimetallic oxide stabilizer has a core-shell structure, with magnetic iron oxide particles as the core, and an amorphous silica protective layer and an active layer sequentially coating the surface of the magnetic iron oxide particles. The active layer is an amorphous, porous network structure of zirconium-aluminum bimetallic oxide. The preparation method of the curing agent of this invention is simple, mild, and easy to industrialize. The main raw material is industrial solid waste slag, achieving "waste treatment with waste," with a small amount of agent added and low overall treatment cost.

The application discloses a kind of wide distribution water-soluble ammonium polyphosphate and preparation method thereof, belong to compound fertilizer technical field.In the production of APP using water-soluble monoammonium phosphate and urea thermal condensation reaction, water-soluble organic matter is introduced, the chain growth window period before APP solidification is extended, and high water-soluble APP powder product with wide distribution of polymerization degree is obtained, so that the fertilizer grade APP product sequence is improved.Monamium phosphate pre-melting combined with APP cold return material process, the operation time is shortened, the production capacity is greatly improved, and the problem of wide distribution water-soluble product cannot be solidified is solved.The organic matter combined with phosphorus in situ in APP product has the potential of chelating trace elements in soil in addition to improving solubility.The method of rapidly producing wide distribution water-soluble APP powder in the application is simple in process, and is convenient for efficient scale production.

The invention relates to the technical field of electronic assembly, in particular to a repair method of a full-array three-dimensional stacked package printed board assembly, which realizes desoldering and assembly soldering of stacked devices on the full-array three-dimensional stacked package printed board assembly by optimizing a heating mode and increasing monitoring of process temperature and heating time. The problems of insufficient soldering, reliability reduction and the like caused by multiple times of heating of surrounding devices in an existing repair method are effectively avoided; and the welding spot quality and the repair efficiency of the repaired printed board assembly part are improved.