An ultraviolet light emitting diode package module structure

Abstract

The invention discloses an ultraviolet light-emitting diode packaging module structure, which relates to the technical field of LED packaging. The front of a ceramic substrate is provided with a line layer connected to a positive electrode pad and a negative electrode pad, and a light emitting diode is connected to the line layer. The disk, the circuit layer and the light-emitting diode can form a conductive circuit, and the light-emitting diode is located in the inner cavity; the side of the metal dam layer opposite to the ceramic substrate is provided with a dam layer groove, and the dam layer groove is used for the passage of the circuit layer. There is a gap between the inner surface of the groove of the dam layer and the surface of the corresponding circuit layer; the surface of the Kovar alloy light-emitting cup opposite to the ceramic substrate is provided with a light-emitting cup groove corresponding to the circuit layer. There is a gap between the surface and the surface of the corresponding circuit layer, and the Kovar one-piece light-emitting cup is provided with a light-emitting cup mouth corresponding to each light-emitting diode; the back of the ceramic substrate is fixed with a back metal layer. The invention ensures the strength of the ceramic substrate and improves the stability of the ultraviolet light emitting diode.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an ultraviolet light emitting diode packaging module structure. Background technique [0002] Deep ultraviolet light-emitting diode (UVC LED) has the characteristics of high reliability, long life, fast response, low power consumption, environmental protection and no pollution. It is widely used in the field of disinfection and sterilization. The packaging module can realize high radiation energy of deep ultraviolet light-emitting diode. Concentrate the light to achieve instant disinfecting effect on bacteria and viruses. [0003] In the prior art, the packaging module adopts the ceramic substrate to open the through hole, and the electroplated metal in the through hole conducts the ultraviolet light-emitting diode process, and the mutual conduction line on the back of the packaging module is insulated from the copper layer on the back by applying insulating ink to realize t...

AI Technical Summary

Problems solved by technology

Since the kovar alloy one-piece light cup and the electroplating dam are metal structures, they cannot be in contact with the front circuit layer, and there is no structure through which the circuit layer passes, and the coplanar existence of the metal and the front circuit cannot be realized. By opening a through hole on the ceramic substrate And electroplate metal in the through hole to conduct the front and back of the ceramic substrate, so that the overall structural integrity of the ceramic substrate cannot be guaranteed, thereby weakening the overall strength of the ceramic substrate's tolerance and heat resistance, and the ceramic back undertakes the circuit conduction function , the electroplated copper layer on the back of the ceramic, and the insulating area required for circuit conduction needs to be separated on the back of the ceramic. The increase in the insulating area in the back of the ceramic reduces the area of ​​the heat dissipation and heat conduction area of ​​the electroplated copper layer on the back of the ceramic substrate, thus weakening the power package. The thermal conductivity of the heat dissipation channel increases the junction temperature of the UV LED, thereby reducing the long-term stability of the UV LED

Images