Wafer performance test sample application all-in-one machine

Abstract

The invention relates to the technical field of sample application and testing after wafer etching, particularly discloses a wafer performance testing and sample application all-in-one machine, and solves the problems that in the prior art, procedures such as sample application, drying, testing and sample supplementing of a wafer need to be completed on different machines, so that the wafer needs to be repeatedly positioned, and the wafer processing efficiency and precision are low. The machine comprises a system control cabinet, bearing leveling supporting legs and universal Foma wheels are symmetrically arranged at the bottom of the system control cabinet, and a wafer placing mechanism, a position adjusting mechanism and a performance testing and sample application integrated mechanism are arranged at the top of the system control cabinet; the wafer sample application and performance testing device integrates wafer sample application and performance testing, improves equipment efficiency, reduces equipment investment, realizes automatic operation of sample application and testing work, improves efficiency and quality, has sample application and performance testing functions, realizes automatic sample application according to system setting after performance testing, and improves working efficiency and wafer yield, and the cost caused by defective products is effectively reduced.

Description

technical field [0001] The invention relates to the technical field of spotting and testing after wafer etching, in particular to an all-in-one machine for wafer performance testing and spotting. Background technique [0002] Wafer generally refers to a wafer, which refers to a silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8-inch and 12-inch. The main processing methods of wafers are sheet processing and batch processing, that is, one or more wafers are processed at the same time. As semiconductor feature sizes become smaller and processing and measurement equipment become more advanced, new data characteristics emerge...

AI Technical Summary

Problems solved by technology

[0006] The present invention proposes an all-in-one machine for wafer performance testing and spotting, which solves the need to complete wafer spotting, drying, testing, and sample replenishment on different machines in the prior art, thus requiring repeated positioning of the wafer , which makes the wafer processing efficiency low and the precision problem

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