Part, plasma reaction device and part machining method

Abstract

The invention relates to the technical field of semiconductors, in particular to a part, a plasma reaction device and a part processing method. The plasma reaction device comprises a reaction cavity, wherein the interior of the reaction cavity is a plasma environment, and the part is exposed in the plasma environment; the part comprises a substrate and a plasma-resistant coating coated on the surface of the substrate, a plurality of grooves with the width W1<=30 nm and the depth H1<=100 nm are formed in the surface of the substrate, and bulges are formed between adjacent grooves; and the plasma-resistant coating covers the side wall surfaces and the bottom surfaces of the grooves and the top surfaces of the bulges. According to the part provided by the invention, the surface of the substrate is coated with the plasma-resistant coating to carry out plasma-resistant protection on the substrate, and the plasma-resistant coating is not prone to cracking, crack propagation and stripping.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a component, a plasma reaction device and a component processing method. Background technique [0002] In the manufacturing process of semiconductor devices, plasma etching is a key process for processing wafers to form design patterns. [0003] In a typical plasma etch process, the process gas (such as CF 4 , O 2 etc.) to form plasma under the action of radio frequency (Rad i oFrequency, RF) excitation. These plasmas undergo physical bombardment and chemical reactions with the wafer surface after the electric field (capacitive coupling or inductive coupling) between the upper electrode and the lower electrode, thereby etching a wafer with a specific structure. [0004] For parts in the reaction chamber, the surface is usually coated with a plasma-resistant coating to protect the substrate from plasma corrosion. However, because the interior of the reaction...

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Problems solved by technology

However, because the interior of the reaction chamber is a thermal cycle shock environment with constant temperature rise and fall, the thermal stress of the plasma-resistant coating coated on the surface of the substrate in the reaction chamber will continue to accumulate during service, and microcracks may occur. Even micro-cracks expand and cause cracking, peeling, etc., which makes the protective function of the plasma-resistant coating invalid, and the substrate covered by it is severely corroded due to exposure to the plasma environment in the reaction chamber.

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