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LED display module based on jet dispensing and processing technology thereof

A technology for display modules and processing technology, which is applied in the direction of printed circuits, printed circuits, and electrical components connected to non-printed electrical components. Cost, ease of use, and material cost reduction effects

Inactive Publication Date: 2021-11-02
无锡浩乘光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above-mentioned technical problems, the object of the present invention is to provide a LED display module based on jet dispensing and its processing technology: using a flip chip as a light source to improve its heat dissipation effect (better heat dissipation and less light decay) and Welding force can reduce the lead welding cost of front-mounted chips. Both flip-chip and front-mounted chips are packaged by jet dispensing equipment. The LED chip is completely wrapped by glue. Compared with the existing SMD solution, the pad is exposed in the air, which can better improve heat dissipation. , Moisture-proof effect, the material cost can be greatly reduced, and the product life is greatly improved, which solves the problem that the current LED digital module needs to be developed separately when the light source with different sizes and different photoelectric parameters is required. The development cost is very high, and the lead welding force is small, and the moisture-proof effect is poor. Poor cooling effect and serious light attenuation

Method used

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  • LED display module based on jet dispensing and processing technology thereof
  • LED display module based on jet dispensing and processing technology thereof
  • LED display module based on jet dispensing and processing technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] see Figure 1-8 As shown, this embodiment is a processing technology of LED display module based on jet dispensing, including the following steps:

[0066] Step 1: The connector 2 makes ohmic contact with the through hole of the PCB board 1 by riveting or welding, so as to realize the circuit connection between the connector 2 and the PCB board 1;

[0067] Step 2: Put the PCB board 1 equipped with the connector 2 into the ultrasonic cleaning equipment, and the cleaning time is 12 minutes;

[0068] Step 3: Firstly, the solder paste is evenly bonded to both ends of the pads of the LED chip 3 area on the PCB 1 by dispensing or printing process, and then the LED chip 3 is bound to the solder paste position through the die-bonding equipment, so that the LED The pad of chip 3 is bonded to the pad of PCB board 1 through solder paste;

[0069] Step 4: After passing through the reflow oven with 8 temperature zones, the solder paste on the PCB board 1 bonded with the LED chip 3...

Embodiment 2

[0084] see figure 1As shown, this embodiment is a LED display module based on jet dispensing, including a PCB board 1, a connector 2, an LED chip 3, glue 4, a plastic reflective cover 5 and a panel 6, and the bottom of the PCB board 1 is connected with a connection A device 2, several LED chips 3 are installed on the top of the PCB board 1, the LED chips 3 are covered with glue 4, a plastic reflective cover 5 is installed on the top of the PCB board 1, and the LED chips 3 are located in the inner cavity of the plastic reflective cover 5, A panel 6 is installed on the top of the plastic reflective cover 5 .

Embodiment 3

[0086] see Figure 2-8 As shown, the present embodiment is a jet dispensing device, including an installation box 101, a material inlet 103, a storage box 104, a first conveyor 105, a jet dispensing head 109, a second conveyor 112 and a mounting base 119, A sealing door 102 is installed on the top of one side of the installation box 101, a feed port 103 is installed in the middle of one side of the installation box 101, and a slideway 106 is installed on both sides of the bottom inner wall of the installation box 101, and a storage box is slidably installed on the slideway 106 104, handles are installed on the airtight door 102 and the storage box 104, the side of the installation box 101 away from the feed port 103 is connected to the first conveyor 105, and the top of the side of the installation box 101 close to the first conveyor 105 is installed with glue Material delivery pump 117, delivery air pump 118 and air extraction pump 144;

[0087] Mounting box 107 is installed...

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Abstract

The invention discloses an LED display module based on jet dispensing and a processing technology thereof, and relates to the field of electroluminescent elements. The LED display module comprises a PCB, a connector, an LED chip, glue, a plastic reflection cover and a panel, a flip chip is adopted as a light source, the heat dissipation effect and the welding force of the flip chip are improved, and the lead welding cost of a normal chip can be reduced. The flip chip and the normal chip are packaged by adopting jet dispensing equipment, and the LED chip is completely wrapped by glue, so that the moisture-proof effect is improved, the material cost can be greatly reduced, the heat dissipation and moisture-proof effects are good, and the service life of the product is greatly prolonged; the jet dispensing equipment is easy to operate and convenient to use, reduces the labor intensity of workers, improves the production efficiency of LED display modules, is suitable for processing LED display modules of different specifications, can control the glue spraying amount, the spraying speed and the shape on an LED chip, and is suitable for jet dispensing of the LED chip.

Description

technical field [0001] The invention relates to the field of electroluminescent elements, in particular to an LED display module based on jet dispensing and a processing technology thereof. Background technique [0002] With the strong demand for quantitative display of the working status of various electrical appliances and industrial control equipment, LED digital modules have the advantages of short development cycle, high brightness and low power consumption compared with liquid crystal displays, which promotes the application of LED digital modules more and more widely. ; [0003] At present, the LED digital module adopts full glue filling and is based on the LED chip first packaged into SMD and then realized by SMT technology. The full glue filling method has high temperature curing deformation, has certain temperature requirements for materials, cannot be repaired, and is prone to foreign objects. SMD is used. Device products need to be developed separately when ligh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/54H01L33/62H05K1/18H05K3/34
CPCH01L33/62H01L33/54H05K1/181H05K3/341H01L2933/005H01L2933/0075H05K2201/10106H05K2201/09372
Inventor 王佳桂建生
Owner 无锡浩乘光电科技有限公司
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