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Circuit adhesive tape and circuit structure

A technology of circuit structure and conductive structure, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of complex process and low efficiency, and achieve the effect of simple process, high efficiency and reduced contact resistance.

Pending Publication Date: 2021-11-02
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, an object of the present invention is to propose a circuit tape, so as to solve the problems of complex process and low efficiency in the prior art

Method used

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  • Circuit adhesive tape and circuit structure
  • Circuit adhesive tape and circuit structure
  • Circuit adhesive tape and circuit structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Such as figure 2 As shown, this embodiment discloses a circuit tape 10, including: a substrate 110, and a first conductive structure 120 formed on the substrate 110, the first conductive structure 120 has at least one An electrical connection portion 121 made of molten metal; wherein, the substrate 110 is made of PET, the first conductive structure 120 is made of copper foil, and the molten metal is made of gallium indium tin eutectic alloy with a melting point of 10.5°C;

[0062] When using the circuit tape, prepare a circuit board to be bonded, the circuit board has a second conductive structure, and the surface of the first conductive structure of the circuit tape is opposite to the surface of the second conductive structure of the circuit board , implementing lamination, so that the electrical connection portion of the first conductive structure overlaps the target position of the second conductive structure.

[0063] In addition, when using the circuit tape, an a...

Embodiment 2

[0065] Such as figure 2 As shown, this embodiment discloses a circuit tape, including: a substrate 110, and a first conductive structure 120 formed on the substrate 110, the first conductive structure 120 has at least one An electrical connection portion 121 formed of molten metal; wherein, the substrate 110 is selected from PI, the first conductive structure 120 is selected from a silver paste line, and the molten metal is selected from an indium-tin eutectic alloy with a melting point of 60°C;

[0066] When the circuit tape is used, it can be combined with the circuit board by means of heat pressing.

Embodiment 3

[0068] Such as Figure 5 As shown, this embodiment discloses a circuit tape, including: a substrate 110, and a first conductive structure 120 formed on the substrate 110, the first conductive structure 120 has at least one An electrical connection part 121 made of molten metal; wherein, the substrate 110 is a composite base material of PI and TPU, and the first conductive structure 120 is formed on the surface of the TPU; the surface of the TPU is also attached with a release film 130 covering the first conductive structure. The first conductive structure 120 is made of gallium-indium alloy with a melting point of 16°C.

[0069] When using this circuit tape, peel off the release film on the circuit tape, and then perform bonding with the circuit board.

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Abstract

The invention discloses a circuit adhesive tape and a circuit structure, and relates to the technical field of electronic circuits. The circuit adhesive tape comprises a substrate and a first conductive structure formed on the substrate, and the first conductive structure is provided with at least one electric connection part at least composed of molten metal; the circuit adhesive tape is applied to a bearing surface in an inverted mode, so that the electric connection part on the circuit adhesive tape is in lap joint with an external second conductive structure, and infiltration connection between the electric connection part and the second conductive structure is achieved. According to the embodiment of the invention, the circuit is designed to be in an adhesive tape form, and is directly assembled with the circuit board in an inverted manner, so that a large-format circuit can be realized, and the infiltration connection of a conductive circuit is realized by utilizing molten metal, on one hand, welding or conductive adhesive is not needed, the process is simple, the efficiency is high, the implementation is easy, and large-scale industrial manufacturing can be met; and on the other hand, the infiltration connection realized by the molten metal can increase the contact area of connection, so that the contact resistance is reduced, and the electrical performance is improved.

Description

technical field [0001] The invention belongs to the technical field of electronic circuits, and in particular relates to a circuit tape and a conductive structure. Background technique [0002] With the continuous development of electronic technology, the demand for electronic technology in all aspects of people's daily life is also increasing, and new electronic products are also emerging. The printed circuit board is the basic component of electronic products (such as PCB hard board, FPC soft board), which is used to realize the electrical connection between functional parts, so as to realize various functions of electronic products. [0003] At present, the production of global circuit boards is mainly based on the traditional etching process, and a small number of circuit boards are produced by printing conductive paste. The above-mentioned preparation processes are more or less affected by the preparation equipment, special-shaped structures, and application scenarios. ...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K1/09
CPCH05K1/11H05K1/09H05K2201/10674H05K2201/0302H05K2203/128
Inventor 于洋宁政
Owner BEIJING DREAM INK TECH CO LTD
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