Large-scale integrated circuit board surface treatment method for cloud computing server
A large-scale integrated circuit and cloud computing server technology, applied in the secondary processing of printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problems of low processing efficiency and affecting production efficiency, so as to improve drying efficiency and production Efficiency, increase the effect of residence time
Inactive Publication Date: 2021-11-05
李若容
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Problems solved by technology
[0004] The surface treatment of existing integrated circuit boards has low processing efficiency, which affects the overall production efficiency
Method used
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Embodiment 1
[0048] see Figure 1-6 A method for treating the surface of a large-scale integrated circuit board for a cloud computing server, comprising the following steps:
[0049] S1 loading: evenly stack the circuit boards on the loading mechanism, use the feeding suction cup 14 to sequentially absorb the circuit boards, and transport them to the feeding conveyor roller, and send them to the integrated grinding plate cleaning and etching machine 2 for processing;
[0050] S2 grinding board: remove the oxide layer on the surface of the circuit board to obtain a microscopically rough surface, so that the subsequent plating or coating combination is more reliable; after grinding the board, wash the circuit board after grinding;
[0051] S3 etching: Weigh out an appropriate amount of ferric chloride block, and then configure the etching solution according to the ratio of ferric chloride block to water about 3:1. When the solution is brown and does not contain any solids, it means the etchi...
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The invention discloses a large-scale integrated circuit board surface treatment method for a cloud computing server and belongs to the technical field of circuit board production and processing. The method comprises the following steps of feeding, uniformly stacking circuit boards on a feeding mechanism, sequentially adsorbing the circuit boards by using a feeding suction cup, and conveying the circuit boards to a feeding conveying roller, feeding into a plate grinding, cleaning and etching all-in-one machine; board grinding, removing an oxide layer on the surface of the circuit board to obtain a microcosmically rough surface so that the subsequent plating or coating combination is more reliable; after board grinding, washing the ground circuit board with water; and etching, weighing a proper amount of ferric trichloride blocks, preparing an etching solution according to the proportion of the ferric trichloride blocks to water being about 3: 1, when the solution is brown and does not contain any solid, indicating that the etching solution is prepared, and then slowly putting the circuit board into the etching solution.
Description
technical field [0001] The invention belongs to the technical field of circuit board production and processing, and in particular relates to a surface treatment method for a large-scale integrated circuit board used in a cloud computing server. Background technique [0002] Cloud computing is considered to be the third wave of IT after personal PCs and the Internet, which will change the way people acquire, process and save information. Cloud computing uses the transmission capacity of high-speed Internet to transfer the data processing process from personal computers or servers to large-scale cloud computing centers, and provides computing power and storage capacity to users in the form of services. Users can use electricity, tap water, etc. Computing power is also used by utilities and billed according to usage. [0003] An integrated circuit (integrated circuit) is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, in...
Claims
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IPC IPC(8): H05K3/38H05K3/22
CPCH05K3/382H05K3/383H05K3/22H05K3/227
Inventor 李若容
Owner 李若容