Electromagnetic inversion modeling method based on six-axis mechanical arm

Abstract

The invention provides an electromagnetic inversion modeling method based on a six-axis mechanical arm. The method specifically comprises the following steps: taking a horizontal plane at the vertical upper height h of a radiation device as a detection point position plane, uniformly distributing a plurality of array probes on the detection point position plane, obtaining the electromagnetic radiation data of the radiation device through the array probes, the electromagnetic radiation data comprises an amplitude value and a phase value of the tangential magnetic field H; carrying out grid division on the surface of the radiation device, distributing the equivalent magnetic current source M in the divided grid, carrying out constraint according to the grid division and the position of the tangential magnetic field H in combination with a Tikhonov regularization method, and establishing a target function F; and performing minimization solution on the target function F, and finally obtaining equivalent magnetic current source M distribution on the surface of the radiation device. Through the method, the electromagnetic radiation data of the radiation device can be obtained in a short time, radiation modeling is performed on the radiation device in combination with an equivalent source inversion method, the radiation mode of the radiation device is further analyzed, the measurement time is saved, and the prediction efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic compatibility and electromagnetic field inversion, and in particular relates to an electromagnetic inversion modeling method based on a six-axis mechanical arm. Background technique [0002] The rapid development of wireless communication products has brought convenience to people's daily life, but it has also inevitably brought serious electromagnetic compatibility problems. The hardware design of modern electronic products is developing in the direction of high density, multi-level, low volume, and high packaging, which makes the circuit layout more and more dense and complex, thus increasing the probability of interference problems between components. Among them, EMC-related issues such as power integrity and signal integrity are the most serious. For increasingly complex system-level structural circuit devices, using 3D multi-physics simulation software such as CST and HFSS to detect ...

AI Technical Summary

Problems solved by technology

[0003]However, current electric field probes and magnetic field probes are for point-by-point near-field detection of a small range of positions. If it is necessary to obtain the overall electromagnetic information of the object under test It is necessary to move the probe frequently for multiple scans, which undoubtedly increases the time cost of scanning, and at the same time, constantly moving the probe will also cause inevitable measurement errors

Images