Electronic material with high thermal stability, and preparation device thereof

Abstract

The invention relates to the technical field of high polymer materials, in particular to an electronic material with high thermal stability, and a preparation device thereof. Chain extension is performed on nano silicon dioxide through polyacrylic acid, the nano silicon dioxide is mixed with tetraethylenepentamine and polyethyleneimine to obtain aminated nano silicon dioxide, epoxy groups are grafted to nano titanium dioxide under the action of isocyanate, hydroxyl-containing flexible chain segments are grafted to the nano titanium dioxide grafted with the epoxy groups under the action of alkaline amine to prapre modified nano titanium dioxide, and finally, epoxy resin, a filler, a diluent, aminated silicon dioxide, modified titanium dioxide, epoxidized soybean oil and a catalyst are mixed to prepare the novel electronic material with high thermal stability. During preparation, a quantitative assembly can accurately control the adding amount of different substances, and the stirring assembly can accurately control the stirring speed, so the preparation of the material is more accurate, a chip is protected more effectively, and the service life of an LED lamp is further prolonged.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to an electronic material with high thermal stability and a preparation device thereof. Background technique [0002] LED lights are composed of five major parts: light-emitting chips, wires, brackets, conductive layers, and packaging materials. [0003] The main function of the packaging material is to protect the chip part and prevent the chip from being corroded by moisture or oxygen in the external environment. [0004] Since the LED lamp is used for a long time, it will generate a lot of heat, which will lead to an increase in temperature, but the current packaging material is prone to cracking at high temperature, so that the chip cannot be protected, and the service life of the LED lamp is shortened. Contents of the invention [0005] The purpose of the present invention is to provide an electronic material with high thermal stability and its preparation device, ...

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Problems solved by technology

[0005] The purpose of the present invention is to provide an electronic material with high thermal stability and its preparation device, aiming to solve the problem that the packaging material in the prior art is prone to cracking at high temperature, so that the chip cannot be protected, which in turn leads to the use of LED lamps. Short-lived technical issues

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