A 3D printing diamond/metal matrix composite material and its preparation method and application

Abstract

The invention discloses a 3D printing diamond / metal matrix composite material and a preparation method and application thereof. The 3D printing diamond / metal matrix composite material comprises a core-shell structure doped diamond, a metal-based material and additives. Structure doped diamond includes core, transition layer, outer shell, coating, porous layer and modification layer. The material preparation method is to mix diamond, metal matrix and additives evenly and then perform 3D printing according to the three-dimensional CAD slice model, and finally obtain the composite material designed by the model; the metal matrix obtained by 3D printing the diamond / metal matrix composite material of the present invention Metallurgical bonding with the diamond surface can improve the bonding strength of diamond / metal matrix, thereby improving the performance of composite materials and diamond tools, and the core-shell structure doped diamond has good ablation resistance, which can effectively avoid and reduce 3D printing. Diamond thermal damage during forming.

Description

technical field

[0001] The invention belongs to the field of composite materials, and in particular relates to a 3D printing diamond / metal matrix composite material and a preparation method and application thereof. Background technique

[0002] With the rapid development of science and technology, the power and integration of electronic equipment used in aerospace, military, industry, national production and other fields are getting higher and higher, and heat dissipation has become an important factor restricting the development of these industries. Especially with the advent of the 5G communication era, the integration of electronic and semi-finished devices has increased geometrically, which has led to a rapid increase in the heat density of electronic devices. Studies have shown that for every 10 °C increase in the temperature of electronic components, the failure rate increases by about one percent. In addition, 55% of failures in electronic equipment are caused by over...