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Silicon-based active matrix type organic light-emitting display and manufacturing method thereof

A technology of a light-emitting display and a manufacturing method, applied in the field of OLED displays, can solve the problems that fine metal masks cannot achieve good alignment, pixel electrical crosstalk, and high device resolution, so as to avoid display defects, reduce electrical crosstalk, and achieve high color. domain effect

Pending Publication Date: 2021-12-14
NANJING GUOZHAO OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, due to the high resolution of the device, the traditional fine metal mask (FMM) can no longer achieve good alignment. Therefore, the whole-surface evaporation scheme is used in the organic evaporation, which causes the following two problems: one is in the dry The edge of the pixel formed by etching the metal, because its state is different from the front of the reflective anode, and there are steps, in the subsequent evaporation of the organic material, it will greatly affect the thickness of the organic material at the step and the front of the reflective anode, which is related to the step There is a risk of causing display quality problems due to direct contact with the metal; the second is that the organic material evaporates on the entire surface of the anode substrate, and the formed film is connected between pixels, causing electrical crosstalk between pixels and limiting the further development of the color gamut of the device. promote

Method used

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  • Silicon-based active matrix type organic light-emitting display and manufacturing method thereof
  • Silicon-based active matrix type organic light-emitting display and manufacturing method thereof

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Embodiment 1

[0038] This embodiment specifically discloses a method for manufacturing a silicon-based active matrix organic light-emitting display, which specifically includes the following steps:

[0039] First, Al is prepared on the substrate 3 as the highly reflective anode metal layer 1, and the fabrication methods include physical vapor deposition and electron beam evaporation;

[0040] Second, perform photolithography and etching patterning on the highly reflective anode metal layer 1 to form an anode pixel structure, and perform deglue treatment on the highly reflective anode metal layer 1 by a dry method or a wet method;

[0041] Third, grow a pixel isolation layer 2 on a substrate 3 with an anode pixel structure, and the material of the isolation layer is SiO x or SiN x ;

[0042] Fourth, the pixel isolation layer 2 is patterned by photolithography to form an array structure;

[0043] Fifth, the pixel isolation layer 2 is etched. After etching, the pixel isolation layer covers ...

Embodiment 2

[0046] This embodiment specifically discloses a method for manufacturing a silicon-based active matrix organic light-emitting display, which specifically includes the following steps:

[0047] (1) On the silicon-based (or glass) substrate 3, use the method of sputtering metal deposition in physical vapor deposition to deposit and prepare a highly reflective anode metal layer Al, and the thickness of the Al layer is 50nm~300nm;

[0048] (2) On the highly reflective anode metal layer Al, spin-coat i-line photoresist, perform exposure and development processes, and realize the required anode electrode pattern on the photoresist;

[0049] (3) Then use methods such as dry etching to etch the metal film, that is, the highly reflective anode metal layer Al, and finally remove the photoresist to realize the patterning of the metal film;

[0050] (4) After step (3) is completed, a layer of SiN is deposited on the highly reflective anode metal layer by chemical vapor deposition. x or S...

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Abstract

The invention discloses a silicon-based active matrix type organic light-emitting display and a manufacturing method thereof. The anode structure of the silicon-based active matrix type organic light-emitting display comprises a substrate, a reflection anode metal layer and a pixel isolation layer, the reflection anode metal layer and the pixel isolation layer sequentially grow on the substrate, and the reflection anode metal layer forms a step structure on the substrate; and the pixel isolation layer covers the substrate between the adjacent reflection anode metal layer, and the pixel isolation layer divides the reflection anode metal layer into a plurality of pixel electrodes which are isolated from one another. The manufacturing method comprises the step that the reflective anode metal layer and the pixel isolation layer are manufactured in a two-time patterning mode. On the basis of increasing the height of the anode step structure, the contact between the pixel edge and an organic film layer is avoided, the electrical crosstalk between the pixels can be reduced, the high color gamut is realized, and the display defect of the device is avoided.

Description

technical field [0001] The invention belongs to the technical field of OLED displays, and in particular relates to a silicon-based active matrix organic light-emitting display and a manufacturing method thereof. Background technique [0002] Organic light-emitting diode (OLED) display is a self-luminous display device that displays images by using light-emitting organic light-emitting diodes. Due to its advantages of thinness, low energy consumption, and high color gamut, it is widely used in mobile phones and televisions. Silicon-based OLED microdisplays use monocrystalline silicon as their driving backplane, have high carrier mobility, and can achieve very high resolution, and have broad application prospects in the fields of AR and VR. Compared with the glass-based OLED adopting the bottom-emission scheme, the silicon-based OLED device adopts the top-emission scheme, so an anode with high reflectivity is required to achieve high brightness of the device. Al or Ag is usual...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/12H10K50/81H10K50/813H10K71/00
Inventor 葛咏杨建兵张阳秦昌兵彭劲松
Owner NANJING GUOZHAO OPTOELECTRONICS TECH CO LTD
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