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LED packaging method

A technology of LED packaging and LED chips, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of aging of packaging glue, affecting light transmission efficiency, and high working junction temperature, so as to avoid accelerated aging, ensure light transmission efficiency, The effect of extending the service life

Inactive Publication Date: 2021-12-21
廊坊熙泰科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the existing technology, the safe junction temperature of the LED chip should be within 110°C, but when the LED chip is used for a long time, the working junction temperature will be higher, and the higher working junction temperature can cause the packaging glue filled on the chip to Colloid accelerates aging and affects its light transmission efficiency

Method used

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Embodiment Construction

[0031] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention. In the following paragraphs the invention is described more specifically by way of example with reference to the accompanying drawings. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0032] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be direc...

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Abstract

The invention discloses an LED packaging method. The method comprises the following steps: 1, performing bracket cleaning: cleaning a bracket, putting the cleaned bracket into a drying machine, and drying; 2, spot-welding a solder paste: spot-welding a layer of solder paste on the electrode of an LED chip; 3, performing reflow soldering and die bonding: fixing the LED chip on which a layer of solder paste spot-welded on the bracket in a reflow soldering machine; 4, dispensing and packaging: mixing high-stability resin and fluorescent powder to prepare fluorescent glue, and dispensing the fluorescent glue on the surface of the LED chip; 5, baking: placing the LED chip subjected to dispensing packaging is placed in a baking oven, and baking for curing; and 6, testing: carrying out an aging test in an aging instrument. The design is reasonable, the conception is ingenious, through the design of the high-temperature solder paste and the high-stability resin, the accelerated aging of the packaging glue body caused by a high working junction temperature can be avoided, the light transmission efficiency of the LED chip is guaranteed, and the service life of the LED chip is greatly prolonged.

Description

technical field [0001] The invention relates to the technical field of LED manufacturing, in particular to an LED packaging method. Background technique [0002] The first batch of LED light-emitting diodes that appeared on the market in the middle of the 20th century have made remarkable progress after decades of progress. Its luminous efficiency has reached the level of thermal radiation light source, its light intensity has reached candlelight level, and its radiation color is rich. Especially the birth of white light LED, the application of LED products in the field of lighting has become a very influential new product. [0003] LED uses the electrons and holes in the semiconductor material to combine with each other and release energy, so that the energy band level changes, and the released energy is displayed by luminescence. LED has the advantages of small size, long life, low driving voltage, low power consumption, fast response rate, good shock resistance, etc., an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/56
CPCH01L33/62H01L33/56H01L2933/005H01L2933/0066
Inventor 晋岩
Owner 廊坊熙泰科技有限公司
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