Atomization device for vacuum coating

Abstract

The invention provides an atomization device for vacuum coating. The atomization device comprises a shell and an atomizer body arranged in the shell, wherein two ends of the atomizer body are respectively provided with a liquid passing connector and an atomization nozzle, the liquid passing connector is used for introducing a liquid organic coating material for atomization of the atomizer body, and the atomizer body is provided with a pressurization joint for pressurization. By using the atomization device disclosed by the invention, the liquid organic coating material is firstly atomized, then the atomized liquid organic coating material can be vaporized, the vaporized organic coating material can be uniformly attached to and coated on the surface of a base material, the film forming process is completed in a vacuum environment, the application range is wide, a thin coating layer can be obtained, the requirement of a thick film can further be met, the uniformity is easy to control, the efficiency is high, and a thin film with high uniformity and higher film layer performance can be obtained.

Description

【Technical field】 [0001] The invention relates to the field of vacuum coating, in particular to an atomizing device for vacuum coating. 【Background technique】 [0002] At present, the commonly used thin film preparation methods in vacuum state include magnetron sputtering, evaporation, plasma-assisted chemical vapor deposition (PECVD), etc., and different coating methods are selected according to the characteristics of the raw materials used. For the case where some coating raw materials are organic liquids, PECVD is generally used for coating in a vacuum state, and some films are prepared by directly coating on the surface of the substrate in an atmospheric environment. [0003] PECVD is used to prepare films in a vacuum state, especially when coating films on flexible substrates. This method of film preparation will pollute the inside of the box (vacuum chamber) and the transmission system, resulting in The material will be damaged during the winding and walking process, ...

AI Technical Summary

Problems solved by technology

[0003] PECVD is used to prepare thin films in a vacuum state, especially when coating on flexible substrates. The preparation of such thin films will pollute the inside of the box (vacuum chamber) and the transmission system, resulting in The material will be damaged during the winding and walking process, and its relative efficiency will also be reduced

In order to improve efficiency and increase the thickness of a film, it is necessary to increase the PECVD source. The increase in the number of PECVD sources will make the winding system of the equipment more complicated, making the film prone to wrinkles during the winding process. For different materials that need to be completed Composed of superimposed film layers, there will be different degrees of mutual interference between the sources, and the troubles caused by solving the interference problem will also make the equipment larger, the winding system becomes complicated, and the difficulty of equipment processing increases sharply.

[0004] If the preparation of the film layer is completed by coating in the atmosphere, the overall performance of the film layer cannot reach the performance of the film layer prepared in a vacuum state. If the method of coating under vacuum is used, good film layer performance cannot be obtained, and Serious pollution to the cavity, low efficiency, unable to obtain a uniform and thin film layer

Images